Numerical Simulation of Dynamic Wetting Behavior in the Wetting Balance Method

Abstract

Wetting balance test is known to be the most versatile method to evaluate wettability during soldering process, because it provides quantitative information and time dependent wetting behavior. There are many other studies exist related with the wetting force, however, as to wetting time, there are few theoretical backgrounds and mathematical analysis. In this study, the wetting time is focused on a wettability index. The wetting curve, which shows time dependant wetting behavior, is predicted by using computer simulation and compared with oil experiment also, the mechanism of meniscus rise is analyzed. As a result, relationship of calculated and measured wetting curve can be obtained. It is found that the viscosity of a liquid is the major variable that determine the wetting time and wetting rate.

A numerical method for curvature driven boundary migration

“…These methods use the phase volume fraction (area fraction, in two-dimensional models) within the computational cells in order to reconstruct the boundary. It has successfully been employed to predict the shape and movement of boundaries in various practical problems [15][16][17][18]. These methods are robust and relatively easy to implement, which are often quoted as the main reasons for their popularity.…”

Optimal conditions for the wetting balance test

“…All of these researchers used the wetting balance test as a tool to investigate the kinetics of the spreading and wetting phenomena in several alloy systems employed in soldering processes. Han et al (2002) modeled the wetting process that occurs in the wetting balance using computational fluid dynamics techniques and compared the model and experimental results using silicon oil.…”