Numerical Simulation of Manifold Microchannel Heat Sinks for Thermal Management in a Li‐Ion Battery

Pan, Mei; Hu, Minglong

doi:10.1002/ceat.202000316

Cited by 11 publications

(5 citation statements)

References 49 publications

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“…Moreover, our ability to reliably create multi-level hierarchical structures will allow us to aggressively scale up forced convection based active cooling device using a second 3D manifold layer for efficient fluid delivery. High performance cooler scale-up is an immensely important goal being pursued in the field of embedded cooling; this will allow us to pack energy dense power electronic components closely together and continue the trend of improving electronics speed and energy density 8 , 43 , 52 , 54 . Pan et al performed numerical simulations in ANSYS Fluent to compare Manifolded Coolers (MMC) design with Traditional 2D Coolers (TMC)s and showed that at same flow rates, the MMCs can achieve similar levels of thermal performance as the TMCs but achieve a massive 4× to 6× reduction in total device pressure and thus, 4× to 6× improvement in Coefficient of Performance (COP) 43 .…”

Section: Resultsmentioning

confidence: 99%

“…High performance cooler scale-up is an immensely important goal being pursued in the field of embedded cooling; this will allow us to pack energy dense power electronic components closely together and continue the trend of improving electronics speed and energy density 8 , 43 , 52 , 54 . Pan et al performed numerical simulations in ANSYS Fluent to compare Manifolded Coolers (MMC) design with Traditional 2D Coolers (TMC)s and showed that at same flow rates, the MMCs can achieve similar levels of thermal performance as the TMCs but achieve a massive 4× to 6× reduction in total device pressure and thus, 4× to 6× improvement in Coefficient of Performance (COP) 43 . In addition to active coolers, such hybrid, multi-height wicks will also enable scale up of heat spreader technologies.…”

Section: Resultsmentioning

confidence: 99%

See 1 more Smart Citation

A novel hardmask-to-substrate pattern transfer method for creating 3D, multi-level, hierarchical, high aspect-ratio structures for applications in microfluidics and cooling technologies

Hazra

Zhang

et al. 2022

Sci Rep

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This letter solves a major hurdle that mars photolithography-based fabrication of micro-mesoscale structures in silicon. Conventional photolithography is usually performed on smooth, flat wafer surfaces to lay a 2D design and subsequently etch it to create single-level features. It is, however, unable to process non-flat surfaces or already etched wafers and create more than one level in the structure. In this study, we have described a novel cleanroom-based process flow that allows for easy creation of such multi-level, hierarchical 3D structures in a substrate. This is achieved by introducing an ultra-thin sacrificial silicon dioxide hardmask layer on the substrate which is first 3D patterned via multiple rounds of lithography. This 3D pattern is then scaled vertically by a factor of 200–300 and transferred to the substrate underneath via a single shot deep etching step. The proposed method is also easily characterizable—using features of different topographies and dimensions, the etch rates and selectivities were quantified; this characterization information was later used while fabricating specific target structures. Furthermore, this study comprehensively compares the novel pattern transfer technique to already existing methods of creating multi-level structures, like grayscale lithography and chip stacking. The proposed process was found to be cheaper, faster, and easier to standardize compared to other methods—this made the overall process more reliable and repeatable. We hope it will encourage more research into hybrid structures that hold the key to dramatic performance improvements in several micro-mesoscale devices.

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Section: Resultsmentioning

confidence: 99%

Section: Resultsmentioning

confidence: 99%

A novel hardmask-to-substrate pattern transfer method for creating 3D, multi-level, hierarchical, high aspect-ratio structures for applications in microfluidics and cooling technologies

Hazra

Zhang

et al. 2022

Sci Rep

View full text Add to dashboard Cite

show abstract

“…Moreover, our ability to reliably create multi-level hierarchical structures will allow us to aggressively scale up forced convection based active cooling device using a second 3D manifold layer for efficient fluid delivery. High performance cooler scale-up is an immensely important goal being pursued in the field of embedded cooling; this will allow us to pack energy dense power electronic components closely together and continue the trend of improving electronics speed and energy density 8,43,52,54 . Pan et al performed numerical simulations in ANSYS Fluent to compare Manifolded Coolers (MMC) design with Traditional 2D Coolers (TMC)s and showed that at same flow rates, the MMCs can achieve similar levels of thermal performance as the TMCs but achieve a massive 4× to 6× reduction in total device pressure and thus, 4× to 6× improvement in Coefficient of Performance (COP) 43 .…”

Section: Improvements In Microfluidicsmentioning

confidence: 99%

“…High performance cooler scale-up is an immensely important goal being pursued in the field of embedded cooling; this will allow us to pack energy dense power electronic components closely together and continue the trend of improving electronics speed and energy density 8,43,52,54 . Pan et al performed numerical simulations in ANSYS Fluent to compare Manifolded Coolers (MMC) design with Traditional 2D Coolers (TMC)s and showed that at same flow rates, the MMCs can achieve similar levels of thermal performance as the TMCs but achieve a massive 4× to 6× reduction in total device pressure and thus, 4× to 6× improvement in Coefficient of Performance (COP) 43 . In addition to active coolers, such hybrid, multi-height wicks will also enable scale up of heat spreader technologies.…”

Section: Improvements In Microfluidicsmentioning

confidence: 99%

A Novel Hardmask-to-Substrate Pattern Transfer Method for Creating 3D, Multi-level, Hierarchical, High aspect-ratio Structures for Applications in Microfluidics and Cooling Technologies

Hazra

Zhang

et al. 2022

Preprint

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This letter solves a major hurdle that mars photolithography-based fabrication of micro-mesoscale structures in silicon. Conventional photolithography is usually performed on smooth, flat wafer surfaces to lay a 2D design and subsequently etch it to create single-level features. It is, however, unable to process non-flat surfaces (already etched wafers) to create more than one level to give rise to multi-level, 3D, hierarchical structures in the substrate. In this study, we have described a novel cleanroom-based process flow that allows for easy creation of such multi-level, hierarchical structures in a substrate. This is achieved by introducing an ultra-thin sacrificial silicon dioxide hardmask layer on the substrate, which is first 3D patterned via multiple rounds of lithography. Then, this 3D pattern is scaled vertically by a factor of 200 – 300 and transferred to the substrate underneath via a single shot deep etching step. The proposed method is also easily characterizable. Using features of different topographies and dimensions, the etch rates and selectivities were quantified, these characterization information were later used while fabricating specific target structure. Furthermore, this study comprehensively compares the novel pattern transfer technique to already existing methods of creating multi-level structures, like grayscale lithography, chip stacking and double-sided etching. The proposed process was found to be cheaper, faster, and easier to standardize compared to other methods – this makes the overall process more reliable and repeatable. We hope it will encourage more research into hybrid structures that hold the key to dramatic performance improvements in several micro-mesoscale devices.

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“…It is an adaptive exponential upwind style, which adds artificial viscosity to the original problem and reduces numerical fluctuations. This paper uses this method as the basic numerical discrete format [2]. We use the coupled Newton iteration method to solve the nonlinear equations and propose using the algebraic multigrid (AMG) preconditioning GMRES method to solve the linear equations in the Newton iteration.…”

Section: Introductionmentioning

confidence: 99%

Numerical Simulation Analysis Mathematics of Fluid Mechanics for Semiconductor Circuit Breaker

Liu

2021

Applied Mathematics and Nonlinear Sciences

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The paper derives the current-voltage relationship in the semiconductor circuit breaker based on the equation of fluid mechanics which has application for safe and water access. Then, the paper proposes a Newton iterative method based on the finite element analysis method to solve the nonlinear algebraic equation relationship in the semiconductor circuit breaker. At the same time, the paper constructed a coupled numerical model based on the hydrodynamic equations and applied it to the pulse current prediction. Experiments have proved that the algorithm can realize large-scale open-circuit switching current forecast, and the algorithm has high efficiency and accuracy.

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Numerical Simulation of Manifold Microchannel Heat Sinks for Thermal Management in a Li‐Ion Battery

Cited by 11 publications

References 49 publications

A novel hardmask-to-substrate pattern transfer method for creating 3D, multi-level, hierarchical, high aspect-ratio structures for applications in microfluidics and cooling technologies

A novel hardmask-to-substrate pattern transfer method for creating 3D, multi-level, hierarchical, high aspect-ratio structures for applications in microfluidics and cooling technologies

A Novel Hardmask-to-Substrate Pattern Transfer Method for Creating 3D, Multi-level, Hierarchical, High aspect-ratio Structures for Applications in Microfluidics and Cooling Technologies

Numerical Simulation Analysis Mathematics of Fluid Mechanics for Semiconductor Circuit Breaker

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