Numerical simulation of the electrical performance of printed circuit boards under cyclic thermal loads

Fellner, Klaus; Antretter, Thomas; Fuchs, Peter; Qi, Tao

doi:10.1016/j.microrel.2016.03.034

Cited by 8 publications

(3 citation statements)

References 23 publications

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“…Void damage was triggered within copper path during plastic cycling. This damage mechanism was also adopted in Fellner et al [4] who made a correlation between the evolution of the electrical resistance and the void volume fraction.…”

Section: Introductionmentioning

confidence: 99%

Experimental characterization of rolled annealed copper film used in flexible printed circuit boards: Identification of the elastic-plastic and low-cycle fatigue behaviors

Girard

Martiny

Mercier

2020

Microelectronics Reliability

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The elastic-plastic and low-cycle fatigue behaviors of copper films are studied experimentally and identified for further simulation works. A rolled annealed copper grade is considered here, as it is often used in flexible printed circuit boards for its mechanical resistance to high elongations. During operation, the printed circuit board (PCB) will undergo various loadings, whether purely mechanical or environmental. These loadings can lead to the fracture of copper and thus to the disconnection of the electrical signal in the PCB. Copper has a low yield stress, so it undergoes easily plastic deformation. In the present work, a predominant kinematic hardening has been observed experimentally and modeled with the combined hardening model of Lemaitre-Chaboche. The fatigue behavior has been identified on cyclic loadings at different strain amplitudes. A Coffin-Manson model has been adopted to reproduce experimental data. Identified behaviors have been introduced in a numerical simulation of a flexible PCB under cyclic bending/reverse bending, in order to estimate its mechanical reliability.

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Section: Introductionmentioning

confidence: 99%

Experimental characterization of rolled annealed copper film used in flexible printed circuit boards: Identification of the elastic-plastic and low-cycle fatigue behaviors

Girard

Martiny

Mercier

2020

Microelectronics Reliability

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“…Some authors [2], [3], [4], [5], [6], [7] address this subject to evaluate the reliability of PTHs by the mean of finite element simulations. In [3], [4], [5], [6], the fatigue behavior of electrodeposited copper was studied by submitting PTHs to thermal loadings. But this method does not permit direct strain measurements and the link between strain and failure has to be carried out through the numerical simulation of a PCB.…”

Section: Introductionmentioning

confidence: 99%

“…However, copper exhibits kinematic hardening. Therefore, this behavior has been taken into account by Fellner et al [6] or Fu et al [12] for PTH studies. Fu et al [12] used a model identified on wrought copper, whereas Fellner et al [6] worked on a copper grade used in PCBs.…”

Section: Introductionmentioning

confidence: 99%

Elastoplastic and fatigue properties of copper in printed circuit boards: from experimental characterization to numerical simulations

Girard¹,

Martiny²,

Mercier³

2020

2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and

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In operation, a Printed Circuit Board (PCB) will face various and repeated thermomechanical loadings that may lead to the failure of the copper, and thus to the malfunction of the PCB itself. In order to simulate and better predict the reliability of PCBs, the constitutive behavior of copper has to be defined. In the present work, a 17 µm rolled annealed copper film frequently used in the flexible PCB industry has been tested under a cyclic tensile-compressive loading. The copper has a low elastic limit and plastic deformation plays thus an important role during straining. Under cyclic loadings, a predominant kinematic hardening has been observed. The plastic behavior of the studied copper film has been identified with a Lemaitre-Chaboche hardening model. Next, an original experimental setup has been developed, allowing to measure the fatigue behavior of thin copper films under cyclic loadings. Tests with various loading amplitudes are carried out. A Coffin-Manson model has been adopted to reproduce the experimental data.

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Defect detection of printed circuit board based on adaptive key-points localization network

Yu,

Zhao,

Wang

et al. 2024

Computers & Industrial Engineering

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Numerical simulation of the electrical performance of printed circuit boards under cyclic thermal loads

Cited by 8 publications

References 23 publications

Experimental characterization of rolled annealed copper film used in flexible printed circuit boards: Identification of the elastic-plastic and low-cycle fatigue behaviors

Experimental characterization of rolled annealed copper film used in flexible printed circuit boards: Identification of the elastic-plastic and low-cycle fatigue behaviors

Elastoplastic and fatigue properties of copper in printed circuit boards: from experimental characterization to numerical simulations

Defect detection of printed circuit board based on adaptive key-points localization network

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