Numerical Simulation of the Junction Temperature, the Coolant Flow Rate and the reliability of an IGBT Module

SPICE-Aided Nonlinear Electrothermal Modeling of an IGBT Module

“…Compact models of power modules dedicated to network simulations are discussed, i.e., in the papers [9,[24][25][26][27][28][29]. The second important group of models includes detailed models formulated, for example, using the FEM or FDM methods [30][31][32]. They make it possible to compute the temperature distribution in the module, but they are dedicated to single devices only and their use in network simulations is complicated [9,25].…”

“…The paper [24] is devoted to the problem of modeling mutual thermal couplings and their modeling on the basis of the material data, whereas the papers [17,33] describe compact thermal models of dies placed on a common substrate. The thermal models presented in [9,[25][26][27][28][29][30][31][32][33] are characterized by a simplified description of the electrical properties of the modeled device. This means that when using such kinds of models, the operating point is not accurately computed and the device junction temperature can be computed only at the known values of the dissipated power.…”