Numerical Study of a Thermosyphon Cooling System: film condensation

Abstract

Studies of condensation in several cooling systems have been conducted. However, the mode of condensation in two-phase cooling systems to achieve a high rate of condensation in compact devices has not been explored. Condensation phenomena, indeed, is a key parameter in designing a thermosyphon water cooled condenser system. The analysis of this condensation phenomena has been done numerically by implementing the governing equations and boundary conditions in commercial MATLAB software. Steady-state laminar film condensation on the radial system is assumed as a condensation phenomenon between vapor and the outer surface of coolant coil. There is a good agreement between experimental and simulation results. Furthermore, for 0.3 LPM 10 °C, it is found the standard deviation of 0.3 %. This small standard deviation indicates the good accuracy of the simulation. At a constant mass flow rate of water, the higher inlet water temperature will result in a higher Nusselt number of water. Furthermore, at the same Nusselt number of water, the lower inlet water temperature obtained a higher film condensation rate. Nusselt number of film condensation increases as the Nusselt number of water decreases at the various constant of mass flow rate of water. Additionally, the lower inlet water temperature will result in a lower Nusselt number of water. The value of Reynold number film condensation increases as Reynold numbers and Nusselt number of water increase. At various constant mass flow rates of the water, at the same Nusselt number of water, the Reynold number of film condensation increases with lower inlet water temperature. The lower inlet water temperature increases the value of Reynold number of film condensation leading to more wavy and turbulent flow. The present study provides guidelines for thermal management engineers to design and fabricate compact cooling systems.