Scanning internal photoemission spectroscopy has been developed to map the electrical characteristics of metal/semiconductor interfaces nondestructively. We conducted two-dimensional characterization of wide-bandgap Schottky contacts such as GaN, SiC, and oxide semiconductors. Our experimental demonstrations of the mapping characterization are reviewed from the aspects of (A) thermal degradation, (B) device degradation by applying highvoltage, (C) process-induced surface damages, (D) grain boundaries of semiconductors and printed metal particles, and (E) expansion to semiconductor/semiconductor and metal-insulator-semiconductor interfaces. This technique was confirmed to be useful for the development of the wide-bandgap-semiconductor high-power devices.