Processing of Wide Band Gap Semiconductors 2000
DOI: 10.1016/b978-081551439-8.50005-5
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Ohmic Contacts to II–VI and III–V Compound Semiconductors

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Cited by 3 publications
(3 citation statements)
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“…This different behavior is likely linked to the absence of Ge in the metal electrodes. Germanium is known to lead to Ni segregation through the formation of NiGe alloys . Energy dispersive X-ray spectrometry (EDS) was used to identify the composition of the NW sections.…”
mentioning
confidence: 99%
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“…This different behavior is likely linked to the absence of Ge in the metal electrodes. Germanium is known to lead to Ni segregation through the formation of NiGe alloys . Energy dispersive X-ray spectrometry (EDS) was used to identify the composition of the NW sections.…”
mentioning
confidence: 99%
“…Germanium is known to lead to Ni segregation through the formation of NiGe alloys. 32 Energy dispersive X-ray spectrometry (EDS) was used to identify the composition of the NW sections. A low-energy (5 kV) primary electron beam was employed with the aim to maximize the contrast of the transformed NW sections and to minimize the SiO 2 /Si substrate signal.…”
mentioning
confidence: 99%
“…Rapid thermal annealing is a powerful tool for the preparation of ohmic contact at metal-semiconductor interfaces, and it can yield to complex inter-diffusion phenomena, as it has been extensively studied in the case of bulk GaAs [1] . We observed that the controlled thermal annealing of GaAs nanowire (NW) devices with Ni/Au electrodes promotes the diffusion of nickel into the nanowire, forming Ni-rich metallic alloy regions in the nanostructured body.…”
mentioning
confidence: 99%