2020
DOI: 10.1002/aelm.202000058
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Omnidirectional Stretchable Inorganic‐Material‐Based Electronics with Enhanced Performance

Abstract: Inorganic material‐based devices are well known for their high performance, excellent stability, and hence suitability for fast computation and communication. But their nonflexibility and nonstretchability often hinder their application in several emerging areas where conformability with irregular 3D surfaces is required in addition to the high performance. Herein, with honeycomb like patterns, the omnidirectional stretchability and conformability of inorganic material‐based device are demonstrated without sac… Show more

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Cited by 40 publications
(22 citation statements)
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“…In this aspect, semiconductor materials whose electronics properties lie between that of conductors and insulators have been widely used. Such materials have been explored in the development of the FETs, LEDs and solar cells [236,237]. In pursuit of the development of devices, various active materials have been investigated and this section provides an overview of such materials.…”
Section: Active Materialsmentioning
confidence: 99%
“…In this aspect, semiconductor materials whose electronics properties lie between that of conductors and insulators have been widely used. Such materials have been explored in the development of the FETs, LEDs and solar cells [236,237]. In pursuit of the development of devices, various active materials have been investigated and this section provides an overview of such materials.…”
Section: Active Materialsmentioning
confidence: 99%
“…This could enhance the granularity of the haptic information obtainable from e-Skin and could enable robots with human-like dexterity, cognitive skills, and abilities [4,[6][7][8]. The advantage of such e-Skin also expands to the provision of high-dimensional information from the environment for application in wearable health-monitoring system, smart phones, displays, and prosthetics [3,4,9,10].…”
Section: Introductionmentioning
confidence: 99%
“…microwires (MWs)) and chip (e.g. ultra-thin chips (UTCs)) scale structures [25,26,[42][43][44][45][46][47][48][49][50][51][52][53]. These nano/micro/chip scale structures are typically single-crystalline and result in high-performance electronics.…”
Section: Introductionmentioning
confidence: 99%
“…The transfer printing (TP) and contact printing (CP) methods developed to transfer or print these structures onto flexible substrates could address the traditional thermal budget issue associated with the inorganic semiconducting materials i.e. due to high-temperature processing requirements it is difficult to fabricate devices directly over flexible polymeric substrates [26,29,47,49,56]. Figure 2 shows a qualitative comparison of these technologies in terms of fabricationcost and device-performance along with their advantages and limitations.…”
Section: Introductionmentioning
confidence: 99%