The study of electrical breakdown behaviors in microgaps has drawn intensive attention around the world due to the miniaturization of electronic devices that allows electronic circuits to be packaged more densely, making possible compact computers, advanced radar and navigation systems, and other devices that use very large numbers of components. Therefore, a clear understanding of the electrical breakdown behaviors in microgaps is required to avoid the dielectric breakdown or to trigger the breakdown at microscale. This chapter introduces the significance of understanding breakdown characterization and reliability assessment for electrostatically actuated devices, magnetic recording devices, photomasks, RF MEMS switches, and micromachines and points out the derivation of the classical Paschen's law at microscale. Then it summarizes the state-of-the-art research work on the methodology, influencing factors, dynamics, and physical mechanisms of electrical breakdown in microgaps, which is expected to expand the general knowledge of electrical breakdown to the microscale regime or more and benefits the reliability assessment and ESD protection of microscale and nanoscale devices.