On-Chip Thermal Gradient Analysis Considering Interdependence between Leakage Power and Temperature

Satō, Takashi; Ichimiya, Junji; Ono, Nobuto; Hashimoto, Masanori

doi:10.1093/ietfec/e89-a.12.3491

“…The interdependence between temperature and leakage has been known for years and several attempts have been made during design time to better estimate/control the leakage and temperature through various design decisions. 31,32 For example 31 estimates the chip thermal and leakage profile while accounting for their interdependence. 32 estimates the chip leakage profile while accounting for thermal variability.…”

Section: Temperature-leakage Interdependencymentioning

confidence: 99%

Dynamic Thermal Management Considering Accurate Temperature-Leakage Interdependency

Shi

¹

,

Srivastava

²

2014

Encyclopedia of Thermal Packaging

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Isr develops, applies and teaches advanced methodologies of design and analysis to solve complex, hierarchical, heterogeneous and dynamic problems of engineering technology and systems for industry and government.Isr is a permanent institute of the university of maryland, within the a. James clark school of engineering. It is a graduated national science foundation engineering research center. AbstractIn this paper, we develop an accurate dynamic thermal management DTM approach considering the interdependency of temperature and leakage. By modeling the leakage-thermal interdependence as a quadratic polynomial, we develop accurate analytical equations that capture the thermal transient. We also identify all the situations in which thermal runaway would occur, which should be avoided by DTM. We then present a discrete dynamic programming algorithm that performs thermalaware task and speed scheduling using the model we derived.Compared to a linear leakage-thermal model [1], owing to our more accurate model, our scheme resulted in 18.2% better performance while maintaining the temperature below constraint.

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“…This interdependence has been known for years and several attempts have been made during design time to better estimate/control the leakage and temperature through various design decisions. For example [6] estimates the chip thermal and leakage profile while accounting for their interdependence. [7] estimates the chip leakage profile while accounting for thermal variability.…”

Section: Introductionmentioning

confidence: 99%

Dynamic Thermal Management Considering Accurate Temperature-Leakage Interdependency

Shi¹,

Srivastava²

2014

Encyclopedia of Thermal Packaging

1

0

View full text Add to dashboard Cite

Isr develops, applies and teaches advanced methodologies of design and analysis to solve complex, hierarchical, heterogeneous and dynamic problems of engineering technology and systems for industry and government.Isr is a permanent institute of the university of maryland, within the a. James clark school of engineering. It is a graduated national science foundation engineering research center. AbstractIn this paper, we develop an accurate dynamic thermal management DTM approach considering the interdependency of temperature and leakage. By modeling the leakage-thermal interdependence as a quadratic polynomial, we develop accurate analytical equations that capture the thermal transient. We also identify all the situations in which thermal runaway would occur, which should be avoided by DTM. We then present a discrete dynamic programming algorithm that performs thermalaware task and speed scheduling using the model we derived.Compared to a linear leakage-thermal model [1], owing to our more accurate model, our scheme resulted in 18.2% better performance while maintaining the temperature below constraint.

show abstract

“…This interdependence has been known for years and several attempts have been made during design time to better estimate/control the leakage and temperature through various design decisions. For example [6] estimates the chip thermal and leakage profile while accounting for their interdependence. [7] estimates the chip leakage profile while accounting for thermal variability.…”

Section: Introductionmentioning

confidence: 99%

Dynamic Thermal Management Considering Accurate Temperature-Leakage Interdependency

Shi¹,

Srivastava²

2014

Cooling of Microelectronic and Nanoelectronic Equipment

1

0

View full text Add to dashboard Cite

Isr develops, applies and teaches advanced methodologies of design and analysis to solve complex, hierarchical, heterogeneous and dynamic problems of engineering technology and systems for industry and government.Isr is a permanent institute of the university of maryland, within the a. James clark school of engineering. It is a graduated national science foundation engineering research center. AbstractIn this paper, we develop an accurate dynamic thermal management DTM approach considering the interdependency of temperature and leakage. By modeling the leakage-thermal interdependence as a quadratic polynomial, we develop accurate analytical equations that capture the thermal transient. We also identify all the situations in which thermal runaway would occur, which should be avoided by DTM. We then present a discrete dynamic programming algorithm that performs thermalaware task and speed scheduling using the model we derived.Compared to a linear leakage-thermal model [1], owing to our more accurate model, our scheme resulted in 18.2% better performance while maintaining the temperature below constraint.

show abstract

On-Chip Thermal Gradient Analysis Considering Interdependence between Leakage Power and Temperature

Cited by 5 publications

References 16 publications

Dynamic Thermal Management Considering Accurate Temperature-Leakage Interdependency

Dynamic Thermal Management Considering Accurate Temperature-Leakage Interdependency

Dynamic Thermal Management Considering Accurate Temperature-Leakage Interdependency

Dynamic Thermal Management Considering Accurate Temperature-Leakage Interdependency

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