On the difference between thermal cycling and thermal shock testing for board level reliability of soldered interconnections

Vries, J.W.C. de; Jansen, M.; Driel, W.D. van

doi:10.1016/j.microrel.2006.05.009

Cited by 24 publications

(2 citation statements)

References 9 publications

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“…Compared with the board-level test method, the impact shear test for the single solder bump is more convenient and economical and is actively pursued by the industries (Song et al, 2012;Tseng et al, 2013;Wang and Nishikawa, 2014). Solder joints provide the mechanical and electrical interconnect between the package and the board in the electronic devices; they are susceptible to failures during thermal shock, but we are probably focusing a lot on Pb-free solder joints and neglecting Sn-Pb solder joints (Wang and Nishikawa, 2014;Vries et al, 2007;Spraul et al, 2007).…”

Section: Introductionmentioning

confidence: 99%

Influence of thermal shock cycles on Sn-37Pb solder bumps

Gan

Xia

Liu

et al. 2019

SSMT

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Purpose With continuous concerning on the toxic of element Pb, Pb-free solder was gradually used to replace traditional Sn-Pb solder. However, during the transition period from Sn-Pb to Pb-free solder, mixing of Sn-Pb and Pb-free is inevitable occurred in certain products, and in China where Sn-Pb solder was still used extensively in certain areas especially. Correspondingly, understanding reliability of Sn-Pb solder joints was very important, and further studies were needed. Design/methodology/approach Thermal shock test between −55°C and 125 °C was conducted on Sn-37Pb solder bumps in the BGA package to investigate the microstructure evolution and the growth mechanism of interfacial intermetallic compound (IMC) layer. The effects of thermal shock on the mechanical property and fracture behavior of Sn-37Pb solder bumps were discussed. Findings Pb-rich phase was coarsened and voids were increased at first; Pb-rich phase was refined and voids were decreased secondly with the increase of thermal shock cycles; the shear strength of solder bumps was slightly decreased after thermal shock, but was back up to 73.67MPa at 2,000 cycles; interfacial IMCs of solder bumps was from typical scallop-type into smooth, the composition of IMCs was from Cu6Sn5 into Cu6Sn5 and Cu3Sn after thermal shock with 1,500 and 2,000 cycles; 20.0 per cent of solder bumps at 1,500 cycles and 9.5 per cent of solder bumps at 2,000 cycles were failure respectively. Originality/value Compared with the board level test method, the impact shear test for the single solder bump is more convenient and economical and is actively pursued by the industries. The shear strength of solder bumps was slightly decreased after thermal shock, but was back up to 73.67 MPa at 2,000 cycles; 20.0 per cent of solder bumps at 1,500 cycles and 9.5 per cent of solder bumps at 2,000 cycles were failure.

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Section: Introductionmentioning

confidence: 99%

Influence of thermal shock cycles on Sn-37Pb solder bumps

Gan

Xia

Liu

et al. 2019

SSMT

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“…It was observed that failure develops with crack propagation in the bulk material in the vicinity of interfacial regions [7][8][9]. The results of thermomechanical fatigue testing (fatigue life tests, thermal shock tests) largely depend on the microstructure of the solder [10][11][12][13]. The mechanical properties of the bulk solder are obviously a function of as-solidified microstructure, yet the "destabilization" of this microstructure and the consequent recrystallization of the Sn phase due to thermal stress under thermal shock conditions pose considerable challenges to the reliability testing of solder joints [14].…”

Section: Introductionmentioning

confidence: 99%

Archives of Metallurgy and Materials

Koncz-Horváth¹,

Gergely²,

Gyökér³

et al. 2019

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In this paper the effect of soldering technique and thermal shock test were investigated on SAC 305 solder joints, produced by two different solder method. The solder joints were subjected to different cycle numbers up to 5000 thermal shock tests with two different thermal profiles of -30/+110°C and -40/+125°C. Microstructural properties of the tested joints were examined with the focus on intermetallic layer thickness and crack formation/propagation. Thickness of the scallop shaped Cu6Sn5 intermetallic layer was increased with increasing cycle number for both THRS and multiwave joints, but the thickening was more effective for the THRS joints. Cracks typically formed at the solder alloy/ PTH barrel and the solder alloy/pin interfaces and propagated along grain boundaries and precipitations of intermetallic compound.

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Fatigue fracture of SnAgCu solder joints by microstructural modeling

et al. 2008

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The ongoing miniaturization trend in the microelectronic industry enforces component sizes to approach the micron, or even the nano scale. At these scales, the underlying microstructural sizes and the geometrical dimensions are comparable. The increasing influence of microscopic entities on the overall mechanical properties makes conventional continuum material models more and more questionable. In this study, the thermomechanical reliability of lead-free BGA solder balls is investigated by microstructural modeling. Microstructural input is provided by orientation imaging microscopy (OIM), converted into a finite element framework. Blowholes in BGA solder balls are examined by optical microscopy and a statistical analysis on their size, position and frequency is conducted. Combining the microstructural data with the appropriate material models, three dimensional local models are created. The fatigue life of the package is determined through a critical solder ball. The thermomechanical reliability of the local models are predicted using cohesive zone based fatigue damage models. The simulation results are validated by statistical analyses provided by the industry.

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On the difference between thermal cycling and thermal shock testing for board level reliability of soldered interconnections

Cited by 24 publications

References 9 publications

Influence of thermal shock cycles on Sn-37Pb solder bumps

Influence of thermal shock cycles on Sn-37Pb solder bumps

Archives of Metallurgy and Materials

Fatigue fracture of SnAgCu solder joints by microstructural modeling

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