2002
DOI: 10.1016/s1350-4495(01)00131-1
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On the internal photoemission spectrum of PtSi/p-Si infrared detectors

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Cited by 15 publications
(10 citation statements)
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“…This SE result confirms the formation of PtSi after RTA process. The thickness of sample A determined by SE analysis was 5 12.80 nm which was confirmed with high accuracy from HTEM image with 12.77 nm as shown in the Fig. 5.…”
Section: Resultssupporting
confidence: 65%
“…This SE result confirms the formation of PtSi after RTA process. The thickness of sample A determined by SE analysis was 5 12.80 nm which was confirmed with high accuracy from HTEM image with 12.77 nm as shown in the Fig. 5.…”
Section: Resultssupporting
confidence: 65%
“…Germanium (Ge) is a good candidate, but unfortunately it is still a relatively weak absorbing material at 1550 nm, moreover, the growth of this compound on silicon is still a challenge in terms of cost and complexity [46]. The latter is the exploitation of the internal photoemission effect (IPE) over the metalsemiconductor Schottky barrier [47]. Silicon infrared photodiodes based on the IPE are already used in the infrared (3-5 micron wavelength) imaging systems [48].…”
Section: Resonant Cavity Enhanced Silicon Photodetector At 155 µMmentioning
confidence: 99%
“…GaAs/AlGaAs heterojunctions [3,13,16,17], PtSi-Si diode [18], Si/HfO2 interfaces [19], and a grapheneinsulator-semiconductor structures [10,11].…”
Section: Introductionmentioning
confidence: 99%