Usually, when applying a metal layer on a hard substrate, an adhesion layer is sometimes used, [8] but if it is applied directly to a flexible substrate, cracks are formed, and constant electrical characteristics cannot be maintained. [9] In addition, since vacuum deposition such as CVD and sputter has the disadvantage that the polymer surface is damaged [10,11] and it is difficult to make a large area, it is essential to secure specialized technology when constructing a conducting layer/electronic circuit on a flexible substrate.To this end, a technology of forming a conductive layer using a solution-based electroless plating technology is an important technology for the manufacture of wearable devices/electronic skin, and many studies have been recently conducted. [12][13][14] A typical application is to use a conductive layer to pattern a circuit and use it as an electronic product, [15] or to fabricate it as a strain sensor or stretchable electrode using resistance change. [16,17] In addition, electroless plating technology is used to manufacture electrodes for bio signal recording. [18] When using electroless plating, a lot of research has been conducted because it has the advantage of being able to form a metal electrode on a non-conductor such as a polymer substrate regardless of the conductivity of the substrate. [19,20] However, when the metal layer is formed using electroless plating, there is a disadvantage in that adhesion to the substrate is not good compared to the metal layer formed using electroplating. Since the disadvantage of the adhesion property of electroless plating is directly connected to the decrease in the performance of the electronic product or the sensitivity of the sensor, various studies are being conducted to solve the problem.When performing electroless plating, the catalyst promotes the reduction reaction of metal ions in the reaction solution to form a metal layer. [21] Therefore, for the purpose of increasing adhesion between metal layer and substrate, research on technologies/materials capable of embedding catalysts on the surface of substrates and activating them has been recently conducted. [22,23] Materials such as self-assembled monolayer (SAM), [24,25] polydopamine (PDM), [26] and bovine serum albumin (BSA) [27] are representative materials studied for this purpose. Chen et al. immobilized Ni particles on the dielectric layer using aliphatic NH2-SAMs. [28] Using this, direct integration of Cu was possible and void/seam-free interconnects of tens of nm scale were successfully fabricated. In addition, polydopamine is a material that mimics mussel adhesive proteinThe authors report a technique that can deposit metal micro/nano structures irrespective of the type of polymer substrate to obtain electrical conductivity of substrate with in situ solution process. Existing electronic products are made on Si-based substrates, but as newly developed markets such as wearable devices are created, there is a need to manufacture electronic devices on organic-based substrates. In order...