On the mechanism and mechanics of material removal in ultrasonic machining

Agarwal, Sanjay

doi:10.1016/j.ijmachtools.2015.05.006

Cited by 49 publications

(10 citation statements)

References 38 publications

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“…and, The ultrasonic polishing process can be abstracted as a large number of abrasive particles high-frequency impact on brittle material surface. As shown in the Fig 3, based on the indentation fracture model [17], when the abrasive particles impact the workpiece, radial cracks appear on the surface of the workpiece, and transverse cracks appear when the abrasive particles are separated from the workpiece. Assuming that only the broken volume of the abrasive particles is considered in the ultrasonic polishing period, the material removal is determined by the length of the transverse cracks and the depth of the longitudinal cracks.…”

Section: Relative Sliding Speed Of Abrasive Particlesmentioning

confidence: 99%

“…In recent decades, scholars have done a lot of research on UVAP. Sanjay Agarwal [17] analyze the material removal mechanism and removal rate of UVAP of glass with a mild steel tool using boron carbide abrasive in water as slurry. The propagation and intersection of radial and median cracks that are induced due to repeated impacts of abrasive particles, which will lead to material removal.…”

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confidence: 99%

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Modeling and analysis of the material removal rate for ultrasonic vibration–assisted polishing of optical glass BK7

Liang

Zhang

Chen

et al. 2021

Int J Adv Manuf Technol

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The emergence of ultrasonic vibration-assisted polishing technology has effectively improved the machining accuracy and efficiency of hard and brittle materials in modern optical industry, however, the material removal mechanism of ultrasonic vibration-assisted polishing (UVAP) still needs to be further revealed. This paper focuses on the material removal mechanism of ultrasonic vibration-assisted polishing of optical glass (BK7), the application of ultrasonic vibration to axial vibration and the atomization of polishing slurry, the material removal model was established. Based on the analysis of the relationship between the nominal distance d of the polishing pad and the actual contact area distribution, the prediction of the material removal profile is realized. In addition, the effects of different parameters on the material removal rate (MRR) were analyzed, including polishing force, spindle speed, abrasive particle size, ultrasonic amplitude, feed rate, and flow-rate of polishing slurry. Based on the motion equation of abrasive particles, the trajectory of abrasive particles in the polishing slurry was simulated, and the simulation results show that the introduction of the ultrasonic vibration field changes the motion state and trajectory of embedded and free abrasive particles. The new model can not only qualitatively analyze the influence of different process parameters on MRR, but also predict the material removal depth and MRR, providing a possibility for deterministic material removal and a theoretical basis for subsequent polishing of complex curved surfaces of optical glass. 1.IntroductionOptical glass (BK7) is widely used in optoelectronics, diffractive optical elements, biomedicine and other fields because of its excellent mechanical properties

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Section: Relative Sliding Speed Of Abrasive Particlesmentioning

confidence: 99%

mentioning

confidence: 99%

Modeling and analysis of the material removal rate for ultrasonic vibration–assisted polishing of optical glass BK7

Liang

Zhang

Chen

et al. 2021

Int J Adv Manuf Technol

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“…However, as it is difficult to observe the USM phenomena directly, a total understanding of the material removal is still not possible. Only qualitative evaluations according to experimental results were reported [13][14][15], except that an analysis model was established recently [16] based on the former study [17]. In other studies, the researchers concentrated on revealing the material removal mechanism [5,18] by assuming the hammering of an abrasive particle in USM as an indentation process.…”

Section: Group Of Materials Predominant Type Of Deformationmentioning

confidence: 99%

Ultrasonic Machining: A Total Mechanical Machining Technology Using Loose Abrasive Particles

Wang¹

2018

Abrasive Technology - Characteristics and Applications

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Although manufacturing technologies are well developed for materials like metals and their alloys, considerable problems still exist in the fabrication of hard and brittle materials including ceramics and glass. Their superior physical and mechanical properties lead to long machining cycle and high production cost. Ultrasonic machining (USM) using loose abrasive particles suspended in a liquid slurry for material removal is considered an effective method for manufacturing these materials. This work gives a brief overview of USM first and then mainly addresses the development of a simulation model of this process using a mesh-free numerical technique, the smoothed particle hydrodynamics (SPH). The crack formation on the work surface impacted by two abrasive particles is studied for understanding the material removal and the interaction of abrasive particles in USM. Experiments are also conducted to verify the simulation results. The SPH model is proven useful for studying USM and is capable of predicting the machining performance.

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“…Fortunately, ultrasonic-assisted electrochemical grinding processing technology (UAECG) was based on the cavitation effect of ultrasonic vibration to promote the circulation of electrolyte and the discharge of electrolytic products and remove the passivation film on the surface of the workpiece on the processing area, thereby improving processing efficiency and stability [19]. S.S. Li, et al was conducted to compare and analyze the difference in cutting force of workpieces between UAECG technology and ultrasonic-assisted pulse electrochemical grinding processing technology.…”

Section: Introductionmentioning

confidence: 99%

Effects of processing parameters on the surface quality of wrought Ni-based superalloy by ultrasonic-assisted electrochemical grinding

Yin

Zhang

et al. 2022

Int J Adv Manuf Technol

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Ni-based GH625 superalloy has been widely employed in the aerospace industry due to its high strength, outstanding corrosion resistance and high temperature resistance. A novel hybrid processing method of ultrasonic-assisted electrochemical grinding (UAECG) can achieve the high-effective removal rate for difficult-to-process materials and thereby avoids the stray corrosion during the process. This study systematically investigated the electrochemical dissolution behaviors of GH625 alloy at low current density and effects of processing parameters on its surface roughness. A qualitative model was proposed to further reveal its removal mechanism for GH625 alloy during UAECG process. Polarization curves depicted that an efficient and stable electrochemical dissolution was achieved at an appropriate temperature (20℃) and concentration (10 wt.%) of NaNO3 electrolyte. The findings also revealed that selective corrosion preferentially occurred on the grain boundary or near the NbC carbides under different current density corrosion circumstance. Compared with ECG process, the excellent surface quality (Ra = 0.37 μm) and taper of the small holes (taper = 0.04 ± 0.005°) are obtained at the optimized condition of pulse voltage of 5.8V, feed rate of 0.6mm /min, cathode speed of 12kr /min and ultrasonic drive amplitude of 60 % by UAECG technology.

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On the mechanism and mechanics of material removal in ultrasonic machining

Cited by 49 publications

References 38 publications

Modeling and analysis of the material removal rate for ultrasonic vibration–assisted polishing of optical glass BK7

Modeling and analysis of the material removal rate for ultrasonic vibration–assisted polishing of optical glass BK7

Ultrasonic Machining: A Total Mechanical Machining Technology Using Loose Abrasive Particles

Effects of processing parameters on the surface quality of wrought Ni-based superalloy by ultrasonic-assisted electrochemical grinding

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