2007
DOI: 10.1002/pssb.200642199
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On the residual stress developed in the nanostructure of computer simulated thin films

Abstract: A 1 + 1 dimensional computer simulation model based on aggregation of hard disks is used to investigate the relationship between the nanostructure of simulated thin metallic (e.g., Ni) films on the (111) face of fcc or the (100) face of hcp substrates under different deposition conditions and the stress developed in these films. The intrinsic mechanical stress in these films, while remaining almost constant up to a certain substrate temperature, passes a tensile stress maximum, which depends on the deposition … Show more

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Cited by 3 publications
(11 citation statements)
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“…III-A). Furthermore, while we do indeed observe fairly significant changes in the film rate of deposition, McCaughey 37 and Jalali-Jafari 24 have both demonstrated through molecular dynamics simulations that decreasing film deposition rate is shown to have either no effect, or to actually increase the inherent void creation, and conclude (as we assert here) that it is ion impact effects causing the observed decline in void concentration with increasing deposition rate (which we capture in the isolated compressive stress component model). Finally, we have measured surface roughness by atomic force microscopy (AFM), which shows no correlation to deposition conditions, further assuring us that the surface evolution is not being substantially altered by changes to the process pressure.…”
Section: Void Collapse Effects On Stresssupporting
confidence: 47%
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“…III-A). Furthermore, while we do indeed observe fairly significant changes in the film rate of deposition, McCaughey 37 and Jalali-Jafari 24 have both demonstrated through molecular dynamics simulations that decreasing film deposition rate is shown to have either no effect, or to actually increase the inherent void creation, and conclude (as we assert here) that it is ion impact effects causing the observed decline in void concentration with increasing deposition rate (which we capture in the isolated compressive stress component model). Finally, we have measured surface roughness by atomic force microscopy (AFM), which shows no correlation to deposition conditions, further assuring us that the surface evolution is not being substantially altered by changes to the process pressure.…”
Section: Void Collapse Effects On Stresssupporting
confidence: 47%
“…Intrinsic stress in amorphous silicon thin films can be viewed as a balance between two distinct but competing forces: the collapse of hydrogenated nanovoids after being formed on the depositing layer creating tensile stress, 24,25 and lattice expansion effects, which are responsible for the creation of compressive stresses in the film through the implantation of ions into the previously deposited layers 26 (often referred to as "ion peening"). While plasma ion momentum dictates both of these forces, it is their relative strength at any given momentum level that determines the net intrinsic stress state of the film.…”
Section: A Origins Of Stressmentioning
confidence: 99%
“…Similar to Refs. [12,13], we roughly estimated the rate of photon-assisted tunneling in SSET irradiated under the conditions of the resonant peak and the gate tuned to the sensitive point, n g ≈ −0.25. The obtained value, Γ ph ∼ 10 4 s −1 , corresponds to an extremely low level of energy dissipation from the CPW into the detector, W D = Γ ph × hf J ∼ 0.7 aW ≈ -151 dBm.…”
Section: Process Shown By the Dashed Arrow Inmentioning
confidence: 99%
“…An important basic question is therefore whether cQED behavior can be observed at high microwave frequencies. However, the required measurement is technically challenging, and dedicated microwave detection techniques [9][10][11][12][13] are necessary for a mK-setup of the dilution fridge at frequencies beyond the standard scale, f r ∼ 10 GHz.…”
mentioning
confidence: 99%
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