2012
DOI: 10.1109/ted.2012.2211600
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On the Static and Dynamic Behavior of the Germanium Electron-Hole Bilayer Tunnel FET

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Cited by 35 publications
(16 citation statements)
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“…In the presence of quantization, different modeling approaches can be followed depending on the different alignment between tunneling and quantization directions. In fact, in a planar device, tunneling can be in-line with the quantization direction, as in the EHBTFET [28], or it can be transverse to the quantization direction. In this paragraph we give more details for the case with tunneling aligned with quantization because the picture changes more dramatically compared to the transverse quantization case, for which expressions similar to equation (11) have been proposed, where only the prefactor is different due to the different dimensionality ofk [29,30].…”
Section: Models For Direct Btbt In Bulk Semiconductorsmentioning
confidence: 99%
“…In the presence of quantization, different modeling approaches can be followed depending on the different alignment between tunneling and quantization directions. In fact, in a planar device, tunneling can be in-line with the quantization direction, as in the EHBTFET [28], or it can be transverse to the quantization direction. In this paragraph we give more details for the case with tunneling aligned with quantization because the picture changes more dramatically compared to the transverse quantization case, for which expressions similar to equation (11) have been proposed, where only the prefactor is different due to the different dimensionality ofk [29,30].…”
Section: Models For Direct Btbt In Bulk Semiconductorsmentioning
confidence: 99%
“…Similarly, for the DG TFET, the probability of the maximum V turn-on is 7.8 × 10 −2 % (0.6 14 ) and the probability of the minimum V turn-on is 2.7 × 10 −4 % (0.4 14 ). In the case of the EHBTFET, as tunneling occurs from the valence band of the channel near SG to the conduction band of the channel near MG, the V turn-on reaches the maximum when all MG grains have a WF of 4.6 eV and all SG grains have a WF of 4.4 eV where MG and SG overlap, as shown in Figure 5a; its probability is 2.0 × 10 −20 % (0.6 35 × 0.4 35 ). Additionally, in the opposite case, as shown in Figure 5b, the V turn-on reaches the minimum and its probability is equal to the probability of the maximum V turn-on .…”
Section: Resultsmentioning
confidence: 99%
“…In the case of the planar TFET and DG TFET, a tunneling current occurs along the channel (lateral tunneling) at the source junction. On the contrary, the tunneling current of the EHBTFET is generated across the channel (vertical tunneling) at the body between two gates, and the electrical characteristics of this structure have been actively studied through TCAD simulations and modeling [34][35][36][37][38].…”
Section: Introductionmentioning
confidence: 99%
“…The only architectural difference between a conventional density gradient (DG)-TFET and the EHBTFET is the asymmetric placement and biasing of the gates. This is required to create gate-source (-drain) underlaps to prevent lateral tunneling [10].…”
Section: Device Working Principlementioning
confidence: 99%