On thermo-mechanical reliability of plated-through-hole (PTH)

Reliability of thermally stressed rigid–flex printed circuit boards for High Density Interconnect applications

“…From the present results, even with some significant variation from one test vehicle to another test vehicle, one can conclude that the reliability of buried holes benefits from thicker plated copper, larger hole diameter and smaller thickness of the PCB. Results and trends are similar to those observed for rigid PCB, see for instance Su et al [16].…”

“…This stationary value is used to estimate PTH fatigue life by means of the CoffinManson model. Su et al [16] investigated the reliability of two layers rigid PCBs made of FR4 (without internal pads) by comparing FEA and experiments performed on test vehicles. Three-dimensional finite element models are created for the simulation.…”

A Life Prediction Model of Multilayered PTH Based on Fatigue Mechanism

“…Osterman [ 6 ] improved the Coffin-Manson model by considering the residual equivalent stress, based on which the equivalent stress and strain values are incorporated into the Coffin-Manson model to evaluate the fatigue life of PTH, where and denote the fatigue strength and ductility coefficient of the material respectively, refers to the fatigue strength exponent (−0.14~−0.06) and refers to the fatigue ductility exponent (−0.7~−0.5). References show that the coefficients depend on different failure criteria, resistance drifting [ 9 , 23 ]: 10%, ; 20%, ; 50%, . …”

“…They then analyzed the effect of different parameters on PTH reliability during the thermal cycle. The finite element method [ 7 , 8 , 9 ] and Bayesian approaches [ 10 , 11 ] have been investigated with regard to the relationship between fatigue life and degradation influenced factors of electronic devices. Remarkably, many researches on fatigue lifetime estimation are concentrated on combining the physics-based models together with monitored or test data under a probabilistic framework [ 12 , 13 , 14 ], which can illuminate and qualify the uncertainty of fatigue failure mechanism effectively under synthetic contributions (such as environment, load, structure, material, manufacture defection, and human factors).…”

Stress evaluation of Through-Silicon Vias using micro-infrared photoelasticity and finite element analysis

“…The thermo-mechanical properties of relevant materials are summarized in Table 1. A periodical boundary condition [16,17] was applied to the model, as shown in Fig. 8.…”