One-step synthesis of nano-porous monolithic polyimide aerogel

Kim, Jin‐Young; Kwon, Jinuk; Kim, Seung Ik; Kim, Myeong-Soo; Lee, Daero; Lee, Sang Rae; Kim, Gunhwi; Lee, Juheon; Han, Haksoo

doi:10.1016/j.micromeso.2016.06.037

Cited by 38 publications

(23 citation statements)

References 31 publications

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“…Previous researches on PI aerogels have tended to improve the mechanical strength and overcome the inherent brittleness by adding cross-linking agents and freeze-drying methods, which can construct continuous 3-dimensional structure to bear stress. [11][12][13] However, the improvement of mechanical properties is almost accompanied by the obvious increase of density and the deterioration of heat insulation performance. 14 Liu et al…”

Section: Introductionmentioning

confidence: 99%

SiC whiskers‐reinforced polyimide aerogel composites with robust compressive properties and efficient thermal insulation performance

Hou

Li²,

Luo

et al. 2020

J of Applied Polymer Sci

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Polyimide (PI) aerogels enable promising application in many fields but are always inhibited by their weak resistance to high temperature and low mechanical properties. Herein, novel PI aerogel composites with efficient heat insulation and high compressive performance are prepared by introducing Silicon carbide whiskers (SiCw) as reinforcement. The SiCw in aerogel function as shrinkage inhibitor and high temperature stabilizer. The addition of SiCw exhibits obvious enhancement and toughening effect, the compressive strength of the PI aerogel composites increases from 1.09 to 1.96 MPa. These PI aerogel composites also show enhanced high temperature stability. The as-prepared PI aerogel composites possess integrated properties of high-temperature resistance, low thermal conductivity, and high compressive strength, which can be the candidate for the application in aerospace.

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Section: Introductionmentioning

confidence: 99%

SiC whiskers‐reinforced polyimide aerogel composites with robust compressive properties and efficient thermal insulation performance

Hou

Li²,

Luo

et al. 2020

J of Applied Polymer Sci

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“…Regardless, the pore size distribution can also be verified by SEM images. The nitrogen adsorption method and mercury injection method have also been widely used to evaluate the multiscale pore size distribution of aerogel materials [ 31 , 32 , 33 , 34 ].…”

Section: Resultsmentioning

confidence: 99%

Experimental Characterization of the Thermal Conductivity and Microstructure of Opacifier-Fiber-Aerogel Composite

Zhang

et al. 2018

Molecules

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Due to their high-porosity, nanoporous structure and pores, aerogel materials possess extremely low thermal conductivity and have broad potential in the thermal insulation field. Silica aerogel materials are widely used because of their low thermal conductivity and high temperature resistance. Pure silica aerogel is very fragile and nearly transparent to the infrared spectrum within 3–8 μm. Doping fibers and opacifiers can overcome these drawbacks. In this paper, the influences of opacifier type and content on the thermal conductivity of silica fiber mat-aerogel composite are experimentally studied using the transient plane source method. The thermal insulation performances are compared from 100 to 750 °C at constant pressure in nitrogen atmosphere among pure fiber mat, fiber mat-aerogel, 20% SiC-fiber mat-aerogel, 30% ZrO2-fiber mat-aerogel and 20% SiC + 30% ZrO2-fiber mat-aerogel. Fiber mat-aerogel doped with 20% SiC has the lowest thermal conductivity, 0.0792 W/m·K at 750 °C, which proves that the proper type and moderate content of opacifier dominates the low thermal conductivity. The pore size distribution indicates that the volume fraction of the micropore and mesopore is also the key factor for reducing the thermal conductivity of porous materials.

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“…The construction of a porous structure in the PI film also are reported to decrease the dielectric constant through the incorporation of air into the film . Yabu et al fabricated honeycomb films with polyamic acid/polyion complex and then prepared a low‐ k polyimide film through the imidization of polyamic acids Kim et al synthesized porous films by placing polyimide precursors in a coagulation bath filled with a non‐solvent by allowing the exchange of solvent with the nonsolvent to form the porous films …”

Section: Characteristics Of the 6fda‐oda Pi Filmmentioning

confidence: 99%

Superhydrophobic and Low‐k Polyimide Film with Porous Interior Structure and Hierarchical Surface Morphology

Dong

et al. 2019

Macro Materials & Eng

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Porous interior structured polyimide (PI) films with a hierarchical surface are fabricated from 4,4′‐(hexafluoroisopropylidene)diphthalic anhydride and 4,4′‐oxydianiline by a water vapor induced phase separation process under a humid environment. Superhydrophobic properties with a water contact angle of 161° are obtained using the hierarchical surface morphology, which can be adjusted from flower‐like to wrinkle‐shape particles facilely by changing the relative humidity. The dielectric constant (k) of the PI film decreases sharply from 2.8 (film prepared under dry conditions) to ≈1.9 (film prepared under humid conditions) because of the interior porous structure and fluorine‐containing framework. Both a low‐k and superhydrophobicity are very important parameters for PI films in microelectronic and insulating applications.

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One-step synthesis of nano-porous monolithic polyimide aerogel

Cited by 38 publications

References 31 publications

SiC whiskers‐reinforced polyimide aerogel composites with robust compressive properties and efficient thermal insulation performance

SiC whiskers‐reinforced polyimide aerogel composites with robust compressive properties and efficient thermal insulation performance

Experimental Characterization of the Thermal Conductivity and Microstructure of Opacifier-Fiber-Aerogel Composite

Superhydrophobic and Low‐k Polyimide Film with Porous Interior Structure and Hierarchical Surface Morphology

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