Online near‐infrared measurements of an epoxy cure process compared to mathematical modeling based on differential scanning calorimetry measurements

Friis-Pedersen, Hans Henrik; Houmøller, Lars Plejdrup; Storm, Birgit Kjærside

doi:10.1002/app.28407

Cited by 4 publications

(3 citation statements)

References 40 publications

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“…In this case DSC is used to determine the exothermic heat created by the curing process of the thermoset polymer, as it turns from a viscous liquid into a solid by cross-linking [36][37][38][39][40][41][42][43][44][45][46][47][48][49][50]. It is assumed that no other phase transitions occur absorbing or developing heat.…”

Section: Heat Flow Measurements By Differential Scanning Calorimetrymentioning

confidence: 99%

A Practical Approach for Data Gathering for Polymer Cure Simulations

Heinze

Echtermeyer

2018

Applied Sciences

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Producing precision parts requires good control of the production parameters. When casting thermoset polymers an understanding of the curing process, with its heat release and associated temperature changes, is important. This paper describes how the cure of a polymer of unknown detailed chemical composition in a large part can be predicted and how the necessary material properties required for the predictions can be obtained. The approach given is a relatively simple method that a part manufacturer can perform. It will not characterize chemical reactions in detail, but it gives sufficient accuracy to describe the process. The procedures will be explained for an example of casting a large block of a filled two-component thermoset polyurethane. The prediction of the degree of cure, the associated heat and temperature increase during the curing of a polymer was successfully done using a standard finite element program with the input parameters reaction energy, the Arrhenius pre-factor and the kinetic function, which describes the chemical reaction. The three parameters could be obtained with standard Differential Scanning Calorimetry (DSC) equipment. The data were analyzed with the model-free isoconversional method combined with the compensation effect. The same set of parameters allowed the prediction of experimental cure behavior over two orders of magnitude of time and at a curing temperature range from room temperature up to 420 K.

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Section: Heat Flow Measurements By Differential Scanning Calorimetrymentioning

confidence: 99%

A Practical Approach for Data Gathering for Polymer Cure Simulations

Heinze

Echtermeyer

2018

Applied Sciences

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“…In work by Friis-Pedersen [169], an epoxy resin containing dicyandiamide and an accelerator (diurone) was investigated under different cure cycles. The mathematical prediction of the degree of cure in a thermoset as a function of time and temperature was investigated and compared to measured data.…”

Section: Parameter Modification Of the Model For D1 Inkmentioning

confidence: 99%

A predictive thermal dynamic model for parameter generation in the laser assisted direct write process

Shang¹,

Fearon²,

Wellburn³

et al. 2011

J. Phys. D: Appl. Phys.

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Declaration I hereby declare that this submission is my own work and that, to the best of my knowledge and belief, it contains no material previously published or written by another person nor material which to a substantial extent has been accepted for the award of any other degree or diploma of the University or other institute of higher learning, except where due acknowledgment has been made in the text: Signature Name: Shuo Shang Date: Friday 17 th August 2012 .

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“…Dicyandiamide (DICY) has been used as a heating latency hardener for epoxy resins for a long time since early 1960s 1, 2. It has been widely introduced into many industrial purposes such as laminates, prepregs, coatings, and adhesives 3–16. DICY is a solid powder with a limited solubility in epoxy resins at ambient temperature,17, 18 resulting in the stability of the corresponding formulations at ambient temperature and the efficient hardening at approximately 190 °C, which is very near to the DICY's melt point.…”

Section: Introductionmentioning

confidence: 99%

Accelerating effects of N‐aryl‐N′,N′‐dialkyl ureas on epoxy‐dicyandiamide curing system

Liu¹,

Kimura²,

Sudo³

et al. 2010

J. Polym. Sci. A Polym. Chem.

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This report focuses on epoxy‐dicyandiamide (DICY) curing system accelerated by N‐aryl‐N′,N′‐dialkyl urea, aiming at clarifying the accelerating mechanism and the relationship between accelerating effect and molecular structure of the accelerators. Nine N‐aryl‐N′,N′‐dialkyl ureas were synthesized and investigated with measurements of differential scanning calorimetry, thermo gravimetric/differential thermal analysis and NMR spectroscopy. The results revealed that the ureas released the corresponding secondary amines by the thermal dissociation in the presence of epoxide, which led to the formation of tertiary amines that catalyze the addition reaction of DICY to epoxide. Moreover, a tendency that the ureas able to release more compact amines exhibited higher acceleration effects was discovered. © 2010 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem, 2010

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Online near‐infrared measurements of an epoxy cure process compared to mathematical modeling based on differential scanning calorimetry measurements

Cited by 4 publications

References 40 publications

A Practical Approach for Data Gathering for Polymer Cure Simulations

A Practical Approach for Data Gathering for Polymer Cure Simulations

A predictive thermal dynamic model for parameter generation in the laser assisted direct write process

Accelerating effects of N‐aryl‐N′,N′‐dialkyl ureas on epoxy‐dicyandiamide curing system

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