2013
DOI: 10.1016/j.apsusc.2012.10.062
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Onset of shadowing-dominated growth of Ag films in glancing angle deposition: Kinetic Monte Carlo simulation

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Cited by 16 publications
(6 citation statements)
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“…Without this strategy, the simulation of the full multilayer growth would have been impossible. Furthermore, the same strategy is used in simulations of metallic growth 24 63 64 enabling a comparison with these studies.…”
Section: Discussionmentioning
confidence: 99%
“…Without this strategy, the simulation of the full multilayer growth would have been impossible. Furthermore, the same strategy is used in simulations of metallic growth 24 63 64 enabling a comparison with these studies.…”
Section: Discussionmentioning
confidence: 99%
“…MD simulation can reproduce the results of experiments for pure metals or alloys, but the temporal scale of MD simulation is usually nano-second scale, at which it is sometimes hard to describe the evolution of NPMs, e.g., dealloying, microstructure coarsening. Kinetic Monte Carlo (KMC) simulations give the possibility for quantitative research which may be useful to guide some experiments on surface diffusion [ 48 ], surface growth [ 49 , 50 ], vacancy diffusion [ 51 , 52 ] and coarsening of domain evolution [ 53 , 54 ]. In KMC simulations, suppose that there are N events may occur which are indexed by the variable i , where 0 < i ≤ N .…”
Section: Simulation Methodsmentioning
confidence: 99%
“…[7][8][9] However, the later method cannot capture features and processes occurring beyond the nanosecond scale which limits its use to the very early stages of electrodeposition. In literature, both methods (MD and KMC) have been used with the embedded atom method (EAM) semiempirical potential to characterize metallic systems interactions, useful for many problems of interest such as diffusion of adatoms on metallic surfaces, [10,11] epitaxial growth, [12][13][14] mechanical properties investigation of metallic glass, [15,16] and metal electrodeposition. [17][18][19] In a combined experimental study with the KMC simulation, Wu et al [20] investigated the effect of process factors (temperature, electrode potential) on surface roughness of Cu-Sn-Zn thin film alloy by single-step electrodeposition.…”
Section: Introductionmentioning
confidence: 99%