2017
DOI: 10.1109/ted.2016.2631241
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Operating Principles, Design Considerations, and Experimental Characteristics of High-Voltage 4H-SiC Bidirectional IGBTs

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Cited by 21 publications
(9 citation statements)
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“…The fig. 3 shows the calculated 1D lateral static performances of a lateral bulk conduction [15]- [17], [19]. The lines represent the calculated ideal characteristics at RT and 250 • C of the bidirectional lateral D3MOSFET device with gate lengths and gate to source lengths of 1 µm and optimized drift lengths.…”
Section: Perspectivesmentioning
confidence: 99%
“…The fig. 3 shows the calculated 1D lateral static performances of a lateral bulk conduction [15]- [17], [19]. The lines represent the calculated ideal characteristics at RT and 250 • C of the bidirectional lateral D3MOSFET device with gate lengths and gate to source lengths of 1 µm and optimized drift lengths.…”
Section: Perspectivesmentioning
confidence: 99%
“…It is noted that Si power devices will continue play an important role because of its competitive or even better performances for low to medium power applications. However, both GaN and SiC has the potential to allow bidirectional voltage blocking capability, making them very appealing for future bidirectional power and energy processing applications [24,25].…”
Section: A Wbg Devices Applicationsmentioning
confidence: 99%
“…The full potential of the topology and control method can be realised by applying discrete bidirectional switches. Samples of such devices are manufactured and reported for Si [57,58], SiC [59,60] and GaN [61,62] semiconductor technologies. Table 2 Qualitative and quantitative comparison of competing topologies (V CF = 20 V, V VF = 400 V, P rated = 300 W f sw = 100 kHz) Parameter Topologies VF DAB [63] Active clamp [25] SMB-HB [34] Proposed (Fig.…”
Section: Experimental Verification and Analysismentioning
confidence: 99%
“…The full potential of the topology and control method can be realised by applying discrete bidirectional switches. Samples of such devices are manufactured and reported for Si [57, 58], SiC [59, 60] and GaN [61, 62] semiconductor technologies.…”
Section: Experimental Verification and Analysismentioning
confidence: 99%