Operation characteristics of a new-type loop heat pipe (LHP) with wick separated from heating surface in the evaporator

Zhu, Kai; Chen, Xiaoqing; Dai, Baomin; Zheng, Mingzhu; Wang, Yabo; Li, Hailong

doi:10.1016/j.applthermaleng.2017.05.140

Cited by 20 publications

(5 citation statements)

References 21 publications

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“…The results show that the LHP can start up smoothly at any heat load and the highest temperature of LHP does not exceed 90 °C [61]. To eliminate a parasitic heat leak in the evaporator and to reduce circulation flow resistance Wang et al (2016) [62][63][64] proposed a novel flat type evaporator with the wick separated from the heating surface, where the circulation inside LHP is mainly driven by the phase change formed at the vapor-liquid interface, unlike a traditional LHP where the pumping force is provided by the capillary wick. The schematic of the evaporator where the heating surface had no direct contact with the wick is presented in Figure 16.…”

Section: Modification In Construction Of Lhpmentioning

confidence: 95%

Recent Advances in Loop Heat Pipes with Flat Evaporator

Szymański

Law

McGlen

et al. 2021

Entropy

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The focus of this review is to present the current advances in Loop Heat Pipes (LHP) with flat evaporators, which address the current challenges to the wide implementation of the technology. A recent advance in LHP is the design of flat-shaped evaporators, which is better suited to the geometry of discretely mounted electronics components (microprocessors) and therefore negate the need for an additional transfer surface (saddle) between component and evaporator. However, various challenges exist in the implementation of flat-evaporator, including (1) deformation of the evaporator due to high internal pressure and uneven stress distribution in the non-circular casing; (2) heat leak from evaporator heating zone and sidewall into the compensation chamber; (3) poor performance at start-up; (4) reverse flow through the wick; or (5) difficulties in sealing, and hence frequent leakage. This paper presents and reviews state-of-the-art LHP technologies; this includes an (a) review of novel manufacturing methods; (b) LHP evaporator designs; (c) working fluids; and (d) construction materials. The work presents solutions that are used to develop or improve the LHP construction, overall thermal performance, heat transfer distance, start-up time (especially at low heat loads), manufacturing cost, weight, possibilities of miniaturization and how they affect the solution on the above-presented problems and challenges in flat shape LHP development to take advantage in the passive cooling systems for electronic devices in multiple applications.

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Section: Modification In Construction Of Lhpmentioning

confidence: 95%

Recent Advances in Loop Heat Pipes with Flat Evaporator

Szymański

Law

McGlen

et al. 2021

Entropy

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“…Perubahan fase dalam perangkat ini terjadi dengan sangat cepat dan efektif, dari cairan menjadi uap di evaporator dan dari uap menjadi cairan di kondensor [3]. Pipa panas telah diterapkan dalam berbagai aplikasi teknologi misalnya, sebagai pendingin perangkat elektronik [4], komponen kedirgantaraan [5], pompa panas dan sistem Pendingin CPU [6], pemanas surya [7], diode pemancar cahaya, dan kontrol termal dua fase. Selain itu, berbagai jenis pipa panas telah dikembangkan, misalnya, pipa panas lurus, pipa panas loop [8], dan pipa panas utra tipis [9].…”

Section: Pendahuluanunclassified

Preparasi Dan Modifikasi Sifat Adhesi Permukaan Metal Foam Untuk Meningkatkan Karakteristik Adhesi

Humaidi,

Suharlan

2024

J. Rek. Ener

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Permukaan metal foam telah berhasil dimodifikasi sehingga mendapatkan permukaan dengan sifat adhesi yang tinggi dengan sudut kontak sebesar 112° pada hari pertama pengamatan. Modifikasi permukaan metal foam dilakukan melalui prosedur pembersihan dan teknik penyemprotan sederhana menggunakan Super Nano hydrophobic Liquid Repellent. Tujuan utama dari penelitian ini adalah untuk mengeksplorasi pengaruh lapisan hidrofobik pada permukaan metal foam terhadap karakteristik kapilaritas yang dimiliki. Metal foam yang dilapisi dengan lapisan hidrofobik menyerap 0,03 gr air dalam 10 detik pertama, kondisi ini berlanjut untuk 50 detik berikutnya dan setelah 90 detik, pemompaan kapiler mencapai titik saturasi di mana jumlah air yang telah mengisi celah kapiler tidak dapat bergerak lagi karena jumlahnya telah mencapai maksimum. Dari penelitian ini juga diproleh kesimpulan bahwa semakin kecil sudut kontak metal foam, maka semakin meningkatkan tekanan kapilernya.

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“…) PUE = (𝑃 𝐼𝑇 + 𝑃 𝑠𝑦𝑠𝑡𝑒𝑚 )/𝑃 𝐼𝑇 (5) where Psystem denotes the total power consumption of the cooling systems, and PIT refers to the power consumption of the IT equipment. Pchiller, Ppump1, and Ppump2 contribute to the power consumption of the chiller, power consumption of Pump-1, and power consumption of Pump-2, respectively.…”

Section: System Constructionmentioning

confidence: 99%

“…Heat sink optimization is mainly reflected in two aspects: shape and internal size optimization. In terms of shape optimization, Maajej [4] and Zhu [5] adopted a finned air-cooled pipe system, and a ring-shaped heat pipe, respectively. Leng [6] designed a two-layer microchannel heat sink and optimized the temperature uniformity and thermal resistance variables of the bottom wall.…”

Section: Introductionmentioning

confidence: 99%