Operation of CCD's with stationary and moving electron-beam input

Antcliffe, G. A.; Roberts, C.G.; Barton, J.B.; Pharr, K.K.; Mueller, Donald W.; Collins, D.R.

doi:10.1109/t-ed.1975.18234

Cited by 8 publications

(1 citation statement)

References 3 publications

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“…Complicated circuitry in front-side bombardment CCD chips has traditionally been ruled out because of the effect of charge accumulation in the gate oxide, which increases the dark current 7 and consequently precludes the electrical operation of devices in the chip within seconds 6 . The present device incorporates metal layers which both protect the underlying gate structures and detect electrons.…”

Section: The New Detector Conceptmentioning

confidence: 99%

Front-side-bombarded metal-plated CMOS electron sensors

Finkelstein

Ginosar

1998

SPIE Proceedings

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Electron detector arrays are employed in numerous imaging applications, from low-light-level imaging to astronomy, electron microscopy, and nuclear instrumentation. The majority of these detectors are fabricated with dedicated processes, use the semiconductor as a stopping and detecting layer, and utilize CCD-type charge transfer and detection. We present a new detector, wherein electrons are stopped by an exposed metal layer, and are subsequently detected either through charge collection in a CCD-type well, or by a measurement of a potential drop across a capacitor which is discharged by these electrons. Spatial localization is achieved by use of two metal planes, one for protecting the underlying gate structures, and another, with metal pixel structures, for two-dimensional detection. The new device does not suffer from semiconductor nonuniformities, and blooming effects are minimized. It is effective for electrons with energies of 2-6 keV. The unique structure makes it possible to achieve a high fill factor, and to incorporate on-chip processing. An imaging chip implementing several test structures incorporating the new detector has been fabricated using a 2 micron double-poly double-metal process, and has been tested inside a JEOL 6400 electron microscope.

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Section: The New Detector Conceptmentioning

confidence: 99%