Opportunities and Challenges in Desktop-Inkjet Based Flexible Hybrid Electronics

Muhaisin, Mohammad Muhtady; Khan, Rafid Adnan; Telfort, Jonathan; Heger, Wolfgang; Roberts, G.W.

doi:10.1109/mwscas.2019.8884906

Cited by 8 publications

(4 citation statements)

References 6 publications

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“…That being said, printed and silicon electronics do not necessarily compete, instead the possibility to combine them creates novel areas of applications resulting in so-called hybrid electronics. [15][16][17][18] One particularly appealing field for combining silicon-based electronics with printing technologies is the back-end packaging. As an example, Roshanghias et al [19] recently studied the feasibility of fan-out wafer-level packaging of capacitive micromachined ultrasound transducers using inkjet-printing.…”

Section: Introductionmentioning

confidence: 99%

Printed Electronics Technologies for Additive Manufacturing of Hybrid Electronic Sensor Systems

Zikulnig

Chang

Bito³

et al. 2023

Advanced Sensor Research

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Requirements for the miniaturization of electronics are constantly increasing as more and more functions are aimed to be integrated into a single device. At the same time, there are strong demands for low-cost manufacturing, environmental compatibility, rapid prototyping, and small-scale productions due to fierce competition, policies, rapid technical progress, and short innovation times. Altogether, those challenges cannot be sufficiently addressed by simply using either printed or silicon electronics. Instead, the synergies from combining those two technologies into so-called hybrid electronics create novel opportunities for advanced capabilities and new areas of applications. In the first part of this review, printing and patterning technologies are presented with potential compatibility with conventional electronics manufacturing techniques. They can be utilized for the fabrication of highly complex structures. Nonetheless, up-scalability, integration, and adaptation for industrial fabrication remain challenging due to technically limiting factors. Consequently, a special focus is placed on the up-scalability, availability of commercial printing, and manufacturing machines, as well as processing challenges for high-volume industrial applications. The second part of this review further provides an overview of exciting and innovative application possibilities of printed electronics, emphasizing sensor applications, as well as additively manufactured integrated circuits.

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Section: Introductionmentioning

confidence: 99%

Printed Electronics Technologies for Additive Manufacturing of Hybrid Electronic Sensor Systems

Zikulnig

Chang

Bito³

et al. 2023

Advanced Sensor Research

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“…Hence, the demand for hybrid electronic systems arises, which creates novel areas of applications combining the best of both worlds. [10][11][12][13] Exploiting such a hybrid approach, a commercial, passive NFC chip has been integrated into the printed sensor tag. Due to the fully passive design, no external battery is required.…”

Section: Introductionmentioning

confidence: 99%

Sustainable Multifunctional Biface Sensor Tag

Rauter

Zikulnig

Moldaschl

et al. 2023

Advanced Sensor Research

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In this article, a sustainable, multifunctional, low‐cost, wireless sensor tag is presented. The sensor tag combines three different environmental sensors in one single platform for the dedicated purpose of wireless structural health monitoring of a variety of applications. However, the adaptive design allows the integration of different sensors depending on the specific sensing task. The material consumption is minimized by double‐sided printing, resulting in compact, resource‐efficient sensor solutions. On one side, the tag is equipped with a printed antenna, a fully passive silicon‐based near‐field communication chip and a carbon‐based strain sensor, while the environmental sensors for humidity and temperature are printed on the other side. Due to its low cost, the usage of environmentally friendly materials and the absence of a battery, the biface sensor tag is a milestone in the field of wireless, sustainable electronics for ubiquitous sensing applications. The fabrication itself comprises a series of processes with a focus on efficient additive manufacturing. The characterization of the three sensors shows sensitivity values and characteristics comparable to those found in literature and industrially manufactured sensors. The utilization of a smartphone for reading out the sensor signals further emphasizes the sustainable approach of this sensor system.

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“…In this respect, printed structures and conventional components must be connected to each other in an electrically conductive manner in order to create a functional electronic system. In that way, a hybrid printed electronics (HPE) subassembly is created [7][8][9].…”

Section: Introductionmentioning

confidence: 99%

Evaluation of detatchable board-to-board interconnects on screen printed electronic structures

Schirmer¹,

Hümmer²,

Klauß³

et al. 2021

Flex. Print. Electron.

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Hybrid printed electronics (HPE) combines advantages of conventional electronics manufacturing technologies such as surface mount technology with those of printed electronics in order to realize more complex electronic systems. To realize the final product, such HPE subassemblies have to be connected to higher-level assemblies. So far interconnection techniques for the so-called level 3 interconnection between printed subsystems and standard electronics have not yet been considered adequately in scientific research. In this paper, alternative detachable level 3 interconnection technologies, i.e. spring loaded contact pins, zero insertion force (ZIF) as well as Non-ZIF connectors are investigated systematically regarding their electrical behaviour against the background of printed electronics. Screen-printed silver filled polymer thick film paste is used to realize printed conductor patterns on flexible polymer substrates, which are connected later on with the alternatives mentioned above. Transition resistance is measured using the four wire method as produced, after repeated mating cycles as well as after accelerated aging tests. The various electrical contacts are subjected to thermal stress in temperature cycling testing and during aging at a constant high temperature. As a result it can be stated, that the sping-loaded contact pins used in this investigation show superior behavior compared with the selected connectors in terms of resistance increase after mating cycles. Concerning long-term behavior after thermal cyling and high temperature storage, all investigated alternaives reveal convincing results.

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Opportunities and Challenges in Desktop-Inkjet Based Flexible Hybrid Electronics

Cited by 8 publications

References 6 publications

Printed Electronics Technologies for Additive Manufacturing of Hybrid Electronic Sensor Systems

Printed Electronics Technologies for Additive Manufacturing of Hybrid Electronic Sensor Systems

Sustainable Multifunctional Biface Sensor Tag

Evaluation of detatchable board-to-board interconnects on screen printed electronic structures

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