2000
DOI: 10.1117/1.602413
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Optical backplanes with integrated polymer waveguides

Abstract: An optical backplane for high bit rate data transmission between processor boards is presented. The backplane consists of lowloss polymer multimode waveguides, integrated micromirrors and lenses for focusing/collimation. Free space transmission is used for the coupling between processor boards and the backplane. Due to an expanded beam, high alignment tolerances between the boards and the backplane are obtained. Backplanes are realized for a 55 cm (21 in.) interconnection length, for a ring network and for a 4… Show more

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Cited by 42 publications
(10 citation statements)
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“…Therefore, additional signal amplification within the board is necessary around 850 nm, which is currently considered for optical interconnects in PCBs [335][336][337][338] due to the maturity of VCSEL technology at this wavelength. Since, polymer channel waveguides are compatible with processes used in the PCB industry it follows that integration of amplifying polymer materials into optical backplanes, which is still in a very formative stage, can be an efficient solution to the problem of maintaining a sufficiently high optical power level.…”
Section: Optical Interconnectsmentioning
confidence: 99%
“…Therefore, additional signal amplification within the board is necessary around 850 nm, which is currently considered for optical interconnects in PCBs [335][336][337][338] due to the maturity of VCSEL technology at this wavelength. Since, polymer channel waveguides are compatible with processes used in the PCB industry it follows that integration of amplifying polymer materials into optical backplanes, which is still in a very formative stage, can be an efficient solution to the problem of maintaining a sufficiently high optical power level.…”
Section: Optical Interconnectsmentioning
confidence: 99%
“…It has a fourlevel-energy structure and a large emission cross-section, which provides significant gain at low excitation power for optical amplification. Emission on the 4 F 3/2 → 4 I 9/2 ground-state transition around 865-930 nm is of interest for signal amplification in integrated optical applications, e.g., data transmission in optical interconnects [13][14][15][16] and medical diagnostics [17,18]. Furthermore, the excited-state transition 4 F 3/2 → 4 I 13/2 at 1330 nm, corresponding to the wavelength of the second standard telecommunication window, is used for high-speed amplification of optical signals at the telecommunication O-band (1260-1360 nm).…”
Section: Introductionmentioning
confidence: 99%
“…Currently optical on-chip interconnects are still subject of intensive research work whereas optical off-chip interconnects have reached a state that there are no serious technical reasons which are against a widespread use in the near future. Most of the proposed optical interconnects for fast board-to-board communication are based on backplane approaches to replace the electrical bus by an optical bus 18,19 . Backplanes are a source for high latency and limited bandwidth in principle, no matter if optical or electronic solutions will be used.…”
Section: Introductionmentioning
confidence: 99%