Optical Interconnect Solution With Plasmonic Modulator and Ge Photodetector Array

Hoessbacher, Claudia; Salamin, Yannick; Fedoryshyn, Yuriy; Heni, Wolfgang; Baeuerle, Benedikt; Josten, Arne; Haffner, Christian; Zahner, Marco; Chen, Hong Tao; Elder, Delwin L.; Wehrli, Silvan; Hillerkuss, D.; Thourhout, Dries Van; Campenhout, Joris Van; Dalton, Larry R.; Hafner, Christian; Leuthold, Juerg

doi:10.1109/lpt.2017.2723727

Cited by 24 publications

(13 citation statements)

References 21 publications

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“…Using Si-PICs and MCF, several SDM links have been demonstrated in the past few years. A chip-to-chip interconnect with a capacity of 80 Gb/s (4 × 20 Gb/s) was presented in 2017, using 9 cores of a 19-core MCF (as illustrated in Figure 25(a)), alongside plasmonic modulators and germanium photodetectors [265]. Later on, an aggregate capacity of 100 Gb/s over 1 km was demonstrated using 4 cores of an MCF with 25 Gb/s modulation, as shown in Figure 25(b) [266].…”

Section: Optical Interfaces For Multicore Transmissionmentioning

confidence: 99%

“…A potential solution is to use hybrid integration with 3D waveguides. For instance, a monolithic FM-MCF multiplexer based on 3D waveguides was proposed in the study by Riesen et al [268], -core fiber were utilized: one core for CW input, 4 cores for transmitter outputs, and 4 for receiver inputs [265]. (b) Illustration of a silicon photonic SDM transmitter for 100 Gb/s 4-channel MCF transmission [266].…”

Section: Optical Interfaces For Multicore Transmissionmentioning

confidence: 99%

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Scaling capacity of fiber-optic transmission systems via silicon photonics

2020

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The tremendous growth of data traffic has spurred a rapid evolution of optical communications for a higher data transmission capacity. Next-generation fiber-optic communication systems will require dramatically increased complexity that cannot be obtained using discrete components. In this context, silicon photonics is quickly maturing. Capable of manipulating electrons and photons on the same platform, this disruptive technology promises to cram more complexity on a single chip, leading to orders-of-magnitude reduction of integrated photonic systems in size, energy, and cost. This paper provides a system perspective and reviews recent progress in silicon photonics probing all dimensions of light to scale the capacity of fiber-optic networks toward terabits-per-second per optical interface and petabits-per-second per transmission link. Firstly, we overview fundamentals and the evolving trends of silicon photonic fabrication process. Then, we focus on recent progress in silicon coherent optical transceivers. Further scaling the system capacity requires multiplexing techniques in all the dimensions of light: wavelength, polarization, and space, for which we have seen impressive demonstrations of on-chip functionalities such as polarization diversity circuits and wavelength- and space-division multiplexers. Despite these advances, large-scale silicon photonic integrated circuits incorporating a variety of active and passive functionalities still face considerable challenges, many of which will eventually be addressed as the technology continues evolving with the entire ecosystem at a fast pace.

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Section: Optical Interfaces For Multicore Transmissionmentioning

confidence: 99%

Section: Optical Interfaces For Multicore Transmissionmentioning

confidence: 99%

Scaling capacity of fiber-optic transmission systems via silicon photonics

2020

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“…Plasmonic phase modulators have been arranged in a number of configurations to create intensity modulators [14,16] and IQ modulators [13]. Intensity modulators reaching 170 GHz speeds, limited only by the experimental setup, have recently been demonstrated [15], enabling new optical interconnect solutions [22] and mm-wave and sub-THz signal processing schemes for future wireless communications and sensing applications. Recent works revealed the crucial influence of the nanoscale metallic slot quality and width on the nonlinear material performance [23] and employed material resonances to further enhance the modulation efficiency [24].…”

Section: Principle Of Operation Of Plasmonic Modulatorsmentioning

confidence: 99%

Plasmonic Modulators for Microwave Photonics Applications

Burla

Bonjour

Salamin

et al. 2017

Asia Communications and Photonics Conference

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“…Recent research has therefore focused on co-integrating silicon photonic devices with electronic components [7]. Various groups have shown either 2D/2.5D integration [8][9][10][11], 3D integration [12][13][14][15][16][17][18][19][20] or monolithic integration [21][22][23][24][25][26][27] to be possible.…”

Section: Introductionmentioning

confidence: 99%

Compact Optical TX and RX Macros for Computercom Monolithically Integrated in 45 nm CMOS

Eppenberger

Bonomi

Moor

et al. 2021

J. Lightwave Technol.

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As the reach of optical communications continues to shrink, photonics is moving from rack-to-rack datacom links to centimeter-scale in-computer applications (computercom) where different architectures are needed. Integrated optical microring resonators (MRRs) are emerging as an attractive choice for fulfilling the more stringent area and efficiency requirements: They offer scaling by wavelength division multiplexing (WDM) and high bandwidth densities. In this paper we present compact electro-optical transmit (TX) and receive (RX) macros for computercom monolithically integrated in 45nm CMOS. They operate with MRR modulators and photodetectors and include all necessary electronics and optics to enable optical links between on-chip data sources and sinks. A most compact implementation for thermal stabilization was enabled by sensing the optical device's bias currents in the driving electronics instead of using external operating point sensing optics. Using a field-effect transistor as heating element -as is possible in monolithic integration platforms -further reduces area and power necessary for thermal control. The TX macro is shown to work for data rates up to 16 Gb/s with a 5.5 dB extinction ratio (ER) and 2.4 dB insertion loss (IL). The RX macro demonstrates a sensitivity of 71 µApp at 12 Gb/s for a BER ≤ 10 -10 . An intra-chip link built with the macros achieves ≤ 2.35 pJ/b electrical efficiency and a BER ≤ 10 -10 at 10 Gb/s. Both macros are realized within 0.0073 mm 2 which amounts to 1.4 Tb/s/mm 2 bandwidth density per macro.

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Optical Interconnect Solution With Plasmonic Modulator and Ge Photodetector Array

Cited by 24 publications

References 21 publications

Scaling capacity of fiber-optic transmission systems via silicon photonics

Scaling capacity of fiber-optic transmission systems via silicon photonics

Plasmonic Modulators for Microwave Photonics Applications

Compact Optical TX and RX Macros for Computercom Monolithically Integrated in 45 nm CMOS

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