2017
DOI: 10.1016/j.optmat.2017.07.042
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Optical waveguides fabricated in Cr:LiSAF by femtosecond laser micromachining

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Cited by 9 publications
(3 citation statements)
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“…Cr:LiSAF is an attractive broadband solid-state laser medium in the near-infrared region [1][2][3][4][5][6]. It shows a broad absorption band centered around 650 nm (FWHM:~100 nm) [7], that enables flexible pumping by low-cost red laser diodes or LEDs (light emitting diodes) [8][9][10][11].…”
Section: Introductionmentioning
confidence: 99%
“…Cr:LiSAF is an attractive broadband solid-state laser medium in the near-infrared region [1][2][3][4][5][6]. It shows a broad absorption band centered around 650 nm (FWHM:~100 nm) [7], that enables flexible pumping by low-cost red laser diodes or LEDs (light emitting diodes) [8][9][10][11].…”
Section: Introductionmentioning
confidence: 99%
“…It is a frontier subject formed by the intersection of biology, medicine, chemistry, physics and materials science. It is the basis for the preparation of artificial tissues or organs, the development of high-performance medical devices, the development of new drug dosage forms and the research of bionic effects [4][5][6].…”
Section: Introductionmentioning
confidence: 99%
“…), micro EDM, micro ECM, laser beam machining, electron beam machining and photo-chemical-machining; For additive processes, the relevant techniques are surface coating (CVD, PVD), direct writing (inkjet, laser-guided), microcasting, microinjection moulding, sintering, photo-electron-forming, chemical deposition, polymer deposition and stereolithography; For deforming processes, there are micro forming (stamping, extrusion, forging, bending, deep drawing, incremental forming, superplastic forming, hydro-forming, punching), hot embossing, and micro/nano-imprinting; For joining processes, the related techniques are micro-mechanical-assembly, resistance, laser, vacuum soldering, bonding/welding, and gluing; For hybrid processes, there are micro-laser-ECM, LIGA and LIGA combined with laser machining, micro-EDM and laser assembly, shape deposition and laser machining, laser assisted micro forming, micro assembly injection moulding, combined micromachining and casting. [10][11][12][13][14][15][16][17] better option for the mass-manufacture of microproducts at a reduced cost with a proper manufacturing facility attached with uniform clearance between micropunch and microdie. Also, micropunching was demonstrated in the punching of circular and noncircular holes as small as 5 microns in size.…”
Section: Introductionmentioning
confidence: 99%