2017
DOI: 10.1007/s10404-017-2016-2
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Optically monitored segmented flow for controlled ultra-fast mixing and nanoparticle precipitation

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Cited by 27 publications
(32 citation statements)
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“…Indeed, the derived equations are analogous to non-linear elastic plate theory (see, e.g., [16]). It is worth noting that inertial effects appears even for quite small Reynolds numbers Re ∼ ε 4 .…”
Section: Discussionmentioning
confidence: 99%
See 1 more Smart Citation
“…Indeed, the derived equations are analogous to non-linear elastic plate theory (see, e.g., [16]). It is worth noting that inertial effects appears even for quite small Reynolds numbers Re ∼ ε 4 .…”
Section: Discussionmentioning
confidence: 99%
“…Results of [3] are relevant for water desalination applications. Paper [4] describes a system for ultra-fast mixing of solvents with aqueous fluids and subsequent precipitation of poorly water soluble drug nanoparticles or colloidal carrier particles. Work [5] describes various applications of carbon nanotubes in nanofluidic-based devices.…”
Section: Introductionmentioning
confidence: 99%
“…Furthermore, the laser machining system includes a galvanometer scanner system (Scanlab RTC 5, Scanlab GmbH, Puchheim, Germany) embedded into a micromachining platform (Microstruct-C, 3DMicromac, Chemnitz, Germany). In the past, this laser system was already used to fabricate devices for nanoparticle precipitation [ 28 ], the analysis of pancreatic islets [ 29 ], point-of-care tests from nitrocellulose [ 30 ], and shape memory alloy (SMA) actuators made from NiTi material [ 31 ]. The fabrication process utilized in this work is shown in Figure 4 :…”
Section: Methodsmentioning
confidence: 99%
“…After laser ablation, the wafer was processed in a clean environment and steeped in a glass etching solution (Phosphoric acid, Hydrofluoric acid and water, 20:6:9) for 90 s in order to smoothen the ablation facets and dissolve residual glass fragments. The ablated wafer and another blank wafer were then inserted in a wafer cleaning machine (Fairchild Convac, Neuenstadt, Germany) that sprays pressurized water and dispenses a mixture of H 2 SO 4 and H 2 O 2 for cleaning and surface activation before thermally bonding the two wafers by placing them in a muffle oven at 620 • for a duration of 6 h. The post-ablation process was adopted from an earlier work by Erfle et al [44,45]. Figure 2 shows laser microscopy images before and after dipping the wafer in glass etching solution.…”
Section: Microfluidic Disc Designmentioning
confidence: 99%
“…surface activation before thermally bonding the two wafers by placing them in a muffle oven at 620° for a duration of 6 h. The post-ablation process was adopted from an earlier work by Erfle et al [44,45]. Figure 2 shows laser microscopy images before and after dipping the wafer in glass etching solution.…”
Section: Microfluidic Disc Designmentioning
confidence: 99%