2018
DOI: 10.1364/oe.26.024343
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Optimisation of ultrafast laser assisted etching in fused silica

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Cited by 87 publications
(60 citation statements)
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“…The technique can be applied to several transparent materials including fused silica, which is widely adopted in optics for its excellent optical and mechanical properties. Recently, etching rate enhancements of up to three orders of magnitude have been demonstrated in fused silica [16,42], paving the way for a new era in glass microfabrication.…”
Section: Ultrafast Laser-assisted Etchingmentioning
confidence: 99%
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“…The technique can be applied to several transparent materials including fused silica, which is widely adopted in optics for its excellent optical and mechanical properties. Recently, etching rate enhancements of up to three orders of magnitude have been demonstrated in fused silica [16,42], paving the way for a new era in glass microfabrication.…”
Section: Ultrafast Laser-assisted Etchingmentioning
confidence: 99%
“…Laser inscription was performed with a Menlo Systems Bluecut fibre laser (Menlo Systems GmbH, Martinsried, Germany), delivering 350 fs pulses at a repetition rate of 250 kHz and a central wavelength of 1030 nm. The laser pulse energy was set to approximately 200 nJ for the majority of the inscription and the polarisation was linear and orientated orthogonally to the intended etching direction in order to achieve the highest etching selectivity as discussed in [16]. The substrate was translated on a motorised three-axis crossed roller bearing stage (Alio Industries, Arvada, CO, USA) with up to 5 nm positioning resolution.…”
Section: Ultrafast Laser-assisted Etchingmentioning
confidence: 99%
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“…The exposure conditions trigger a non-linear absorption process that causes a densification within the laser voxel. As consequence, the etching rate of the material for a KOH solution decrease down to 1000 times compared to the un-exposed material [25]. We generate the object within the substrate by moving the sample and the beam in the fashion of a 3D printer.…”
Section: Micromachining On Glassmentioning
confidence: 99%
“…Therefore, it is necessary to increase the efficiency (ablated material/unit energy/unit of time) of the micromachining process as much as possible to fulfil the necessary requirements. Several techniques exist for processing materials with femtosecond pulses which include: direct ablation in air [14,15], back side wet etching [16][17][18], spatiotemporally enhanced focusing [19,20], laser-assisted etching (LAE) [21][22][23][24][25][26], and gas-assisted processing [27][28][29]. Although the techniques presented above all have their advantages and disadvantages, when talking about cutting/drilling deep (> 500 µm) structures inside the material, all of the stated techniques fall short (with the exception of LAE), and ultimately fall victim to slow processing and heat-affected zones around the cut.…”
Section: Introductionmentioning
confidence: 99%