“…When the heat flux reaches up to 100 W cm À2 , the conventional cooling technology is failed to meet the requirement of thermal removal as expected. Fortunately, the microchannel heat sink (MCHS) proposed by Tuckerman and Pease [1] in 1981 can endure a heat flux as high as 790 W cm À2 , which becomes a significant way for thermal management of microelectronic devices and attracts a great deal of attention [2][3][4][5][6][7][8][9][10][11][12][13][14][15][16][17][18][19][20].…”