2006
DOI: 10.1016/j.tsf.2005.07.058
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Optimization of Al-CVD process based on elementary reaction simulation and experimental verification: From the growth rate to the surface morphology

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Cited by 7 publications
(7 citation statements)
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“…3, it can be seen that the amount of carbon contaminant in films, originating from incomplete oxidation and local formation of TMA is reduced with increase in deposition temperature. Compared to reported carbon content for ALD-grown Al 2 O 3 films using Al(mmp) 3 or TMA chemistry at deposition temperature of 300 C, much lower values are obtained for DMAH-induced AlO x N y films in our case, 25,27 and a similar phenomenon has been observed by Sugiyama et al [28][29][30][31] Based on their observations, the lower carbon content for DMAH-derived samples can be attributed to the existence of the following disproportionation reactions: Therefore, on the surface, DMAH decomposes to TMA [Al(CH 3 ) 3 ] and -CH 3 and -H. These components will react with each other to form TMA and CH 4 . Thus, CH 3 radicals on the surface will be removed as gaseous product Al(CH 3 ) 3 (TMA) and CH 4 , which leads to lower carbon content of the films.…”
Section: Film Growth and Characterizationsupporting
confidence: 75%
“…3, it can be seen that the amount of carbon contaminant in films, originating from incomplete oxidation and local formation of TMA is reduced with increase in deposition temperature. Compared to reported carbon content for ALD-grown Al 2 O 3 films using Al(mmp) 3 or TMA chemistry at deposition temperature of 300 C, much lower values are obtained for DMAH-induced AlO x N y films in our case, 25,27 and a similar phenomenon has been observed by Sugiyama et al [28][29][30][31] Based on their observations, the lower carbon content for DMAH-derived samples can be attributed to the existence of the following disproportionation reactions: Therefore, on the surface, DMAH decomposes to TMA [Al(CH 3 ) 3 ] and -CH 3 and -H. These components will react with each other to form TMA and CH 4 . Thus, CH 3 radicals on the surface will be removed as gaseous product Al(CH 3 ) 3 (TMA) and CH 4 , which leads to lower carbon content of the films.…”
Section: Film Growth and Characterizationsupporting
confidence: 75%
“…We hope that the text has been improved pressure vapour phase deposition, e.g. sputtering [4,5] and CVD [6,7], or by high temperature processing, e.g. thermal spraying [8,9] and hot dipping [10,11].…”
Section: Regarding the Deposition Section (Second Half Of Page 13): Tmentioning
confidence: 99%
“…Moreover, aluminum CVD films with DMAH have been examined for integrated circuits because of its low carbon impurity content, the possibility of forming aluminum films with excellent gap-filling properties, and high deposition rate. [25][26][27] The higher deposition rate using DMAH is achieved by reducing the steric effect by different ligands, which increases the number of available reaction sites. 28) However, there are have been a few studies on using DMAH in the ALD-Al 2 O 3 films.…”
Section: Introductionmentioning
confidence: 99%