Optimization of Electronic Components Mounting Sequence for 3D MID Assembly Process

Kurnosenko, Alexey E.; Arabov, D I

doi:10.18502/keg.v3i6.3009

Cited by 7 publications

(8 citation statements)

References 4 publications

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“…The considered approaches have found wide application in the implementation of modern educational techniques in the context of the economy and manufacturing digitalization. When organizing and conducting technological business games, simulation tools give a high synergistic effect [9][10][11]19]. In particular, when training teams for participation in engineering competitions, for example, robotic ones, these approaches, methods and tools allow detailed modeling of the robots' behavior according to a given competition program [4,5].…”

Section: Analysis Of the Resultsmentioning

confidence: 99%

Simulation Modeling Methods and Tools in the Study of Electronics Preproduction

et al. 2020

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The paper is devoted to the selection and application of simulation methods and tools when creating a digital model of the production floor and the preproduction of the assembly process of electronic modules on printed circuit boards. The advantage of simulation modeling for creating a digital manufacturing model is shown. The introduction of simulation methods in the educational process is considered. Using the developed digital model for the manufacturing of a typical product as an example, the functional capabilities of the Plant Simulation module from the Tecnomatix software package developed by Siemens PLM Software are considered. The main simulation results in terms of productivity of the designed production floor are considered. The digital model was improved in order to increase the technological equipment utilization rate and the total productivity of the assembly floor.

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Section: Analysis Of the Resultsmentioning

confidence: 99%

Simulation Modeling Methods and Tools in the Study of Electronics Preproduction

et al. 2020

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“…Even so, it is difficult to build interconnected metal patterns on the surfaces of more complex 3D parts using traditional microfabrication techniques such as lithography, deposition, etching, and release. Because the manufacturing of 3D metal–plastic components requires laser direct structuring (LDS), the fabrication of such parts can be expensive and may involve a long production cycle, a high degree of complexity, and low design flexibility. − …”

Section: Introductionmentioning

confidence: 99%

New Metal–Plastic Hybrid Additive Manufacturing for Precise Fabrication of Arbitrary Metal Patterns on External and Even Internal Surfaces of 3D Plastic Structures

Song

Cui

Tao

et al. 2022

ACS Appl. Mater. Interfaces

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Constructing precise metal patterns on complex three-dimensional (3D) plastic parts allows the fabrication of functional devices for advanced applications. However, it is currently expensive and requires complex processes. This study demonstrates a process for the fabrication of 3D metal–plastic composite structures with arbitrarily complex shapes. A light-cured resin is modified to prepare the active precursor allowing subsequent electroless plating (ELP). A multimaterial digital light processing 3D printer was newly developed to fabricate the parts containing regions made of either standard resin or active precursor nested within each other. Selective 3D ELP processing of such parts provided various metal–plastic composite parts having complicated hollow structures with specific topological relationships with the resolution of 40 μm. Using this technique, 3D devices that cannot be manufactured by traditional methods are possible, and metal patterns can be produced inside plastic parts as a means of further miniaturizing electronics. The proposed method can also generate metal coatings exhibiting improved adhesion of metal to substrate. Finally, several sensors composed of different functional materials and specific metal patterns were designed and fabricated. The present results demonstrate the viability of the proposed method and suggest potential applications in the fields of 3D electronics, wearable devices, and sensors.

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“…Class 2 1 2 D permits to produce sample that have flat or plane-parallel process surfaces in Z direction and on the reverse Polymers 2020, 12, 1408 2 of 33 side of processed surfaces two or more plane-parallel. On the other hand, the class n × 2D and 3D is an interconnected device that consist of multiple process surfaces intersected at the angles or have freeform surfaces [16][17][18][19][20]. to produce sample that have flat or plane-parallel process surfaces in Z direction and on the reverse side of processed surfaces two or more plane-parallel.…”

Section: Introductionmentioning

confidence: 99%

“…The conventional planar process surface (2D) Polymers 2020, 12, x FOR PEER REVIEW 2 of 36 to produce sample that have flat or plane-parallel process surfaces in Z direction and on the reverse side of processed surfaces two or more plane-parallel. On the other hand, the class n × 2D and 3D is an interconnected device that consist of multiple process surfaces intersected at the angles or have freeform surfaces [16][17][18][19][20]. The conventional planar process surface (2D)…”

Section: Introductionmentioning

confidence: 99%

3D-MID Technology for Surface Modification of Polymer-Based Composites: A Comprehensive Review

et al. 2020

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The three-dimensional molded interconnected device (3D-MID) has received considerable attention because of the growing demand for greater functionality and miniaturization of electronic parts. Polymer based composite are the primary choice to be used as substrate. These materials enable flexibility in production from macro to micro-MID products, high fracture toughness when subjected to mechanical loading, and they are lightweight. This survey proposes a detailed review of different types of 3D-MID modules, also presents the requirement criteria for manufacture a polymer substrate and the main surface modification techniques used to enhance the polymer substrate. The findings presented here allow to fundamentally understand the concept of 3D-MID, which can be used to manufacture a novel polymer composite substrate.

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Optimization of Electronic Components Mounting Sequence for 3D MID Assembly Process

Abstract: .

Cited by 7 publications

References 4 publications

Simulation Modeling Methods and Tools in the Study of Electronics Preproduction

Simulation Modeling Methods and Tools in the Study of Electronics Preproduction

New Metal–Plastic Hybrid Additive Manufacturing for Precise Fabrication of Arbitrary Metal Patterns on External and Even Internal Surfaces of 3D Plastic Structures

3D-MID Technology for Surface Modification of Polymer-Based Composites: A Comprehensive Review

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