2007
DOI: 10.1117/12.711978
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Optimization of lithography process to improve image deformation of contact hole sub-90 nm technology node

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Cited by 5 publications
(6 citation statements)
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“…Regarding CER, one can find in literature few papers which use conventional AFM for the characterization of the sidewall roughness of photonic crystal holes [5], while no work has been done on scatterometry. In this work, we follow the main trend and use top-down SEM images as input in CER evaluation methodology [1][2][3][6][7][8][9]. The steps of this methodology are shown schematically in Fig.…”
Section: Cer Evaluation Methodologymentioning
confidence: 99%
“…Regarding CER, one can find in literature few papers which use conventional AFM for the characterization of the sidewall roughness of photonic crystal holes [5], while no work has been done on scatterometry. In this work, we follow the main trend and use top-down SEM images as input in CER evaluation methodology [1][2][3][6][7][8][9]. The steps of this methodology are shown schematically in Fig.…”
Section: Cer Evaluation Methodologymentioning
confidence: 99%
“…The involvement of edge length effects in CER process and material dependencies is not clear and more investigations are needed. Nevertheless, the literature devoted to the process effects on CER is very limited and to our knowledge very few works have been reported on exposure-dose effects [5,9]. In previous work, we studied the effects of exposure dose on CER parameters and recalled the edge length effects to explain the difference with LER behavior characterized by the well-known RLS trade off [15,19].…”
Section: Introductionmentioning
confidence: 95%
“…[8][9][10] CER also plays a significant role in photonics since it contributes to the propagation losses in the performance of a photonic crystal with holes and changes its refractive index. [3][4][5][6][7]14 In previous works of our group, we have developed and presented an advanced measurement and characterization methodology of CER and critical dimension uniformity (CDU), which starts from top-down scanning electron microscope (SEM) images of contact hole patterns and the detection of their edges, and results in the estimation of local and global CDU measures (CD variances) and CER metrics such as root mean square (RMS), correlation length, fractal exponent, power spectrum (PS) and height-height correlation function (HHCF). [3][4][5][6][7]14 In previous works of our group, we have developed and presented an advanced measurement and characterization methodology of CER and critical dimension uniformity (CDU), which starts from top-down scanning electron microscope (SEM) images of contact hole patterns and the detection of their edges, and results in the estimation of local and global CDU measures (CD variances) and CER metrics such as root mean square (RMS), correlation length, fractal exponent, power spectrum (PS) and height-height correlation function (HHCF).…”
Section: Introductionmentioning
confidence: 99%
“…Similar behavior has also been reported in the literature. 14 Initial modeling works focused on the evaluation of photon shot noise (PSN) effects and the critical resist sensitivity below which they can be observed. [3][4][5][6][7] The reported trends are summarized in Table 1.…”
Section: Introductionmentioning
confidence: 99%