2022
DOI: 10.1007/s00170-022-10464-0
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Optimization of polishing path and material removal for uniform material removal in optical surface polishing

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Cited by 5 publications
(2 citation statements)
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“…Optical polishing processes are typically classified into two types: sub-aperture polishing processes that use a small tool to scan the optic surface [1] , and full-aperture continuous polishing processes that use a lap substantially larger than the optical elements being polished [2] . The full-aperture continuous polishing machine consists of an annular pitch layer prepared on a substrate platen as the polishing lap, as shown in Fig.…”
Section: Introductionmentioning
confidence: 99%
“…Optical polishing processes are typically classified into two types: sub-aperture polishing processes that use a small tool to scan the optic surface [1] , and full-aperture continuous polishing processes that use a lap substantially larger than the optical elements being polished [2] . The full-aperture continuous polishing machine consists of an annular pitch layer prepared on a substrate platen as the polishing lap, as shown in Fig.…”
Section: Introductionmentioning
confidence: 99%
“…For instance, Qu, X. [18] implemented scanning paths and employed numerical methods to determine the optimal spacing value of the polishing paths. They controlled the removal depth by optimizing the feed rate, thus mitigating over-polishing in the edge area.…”
Section: Introductionmentioning
confidence: 99%