2015
DOI: 10.1016/j.mssp.2015.01.039
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Optimization of the nanopore depth to improve the electroluminescence for GaN-based nanoporous green LEDs

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Cited by 7 publications
(5 citation statements)
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“…Much progress has been made in LEE by nanostructures on emission surface of green LEDs 1 2 3 4 5 6 7 8 9 10 11 . These structures are fabricated by electron beam lithography (EBL) 1 2 , laser interference lithography (LIL) 3 4 , nanoimprint lithography (NIL) 5 6 7 8 9 , and anodic aluminum oxide (AAO) 10 11 . The LEE enhancements for the patterned green LEDs in the above reports range 19% to 25 times compared to the planar ones, depending on the nanostructure parameters and LEE measuring conditions.…”
mentioning
confidence: 99%
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“…Much progress has been made in LEE by nanostructures on emission surface of green LEDs 1 2 3 4 5 6 7 8 9 10 11 . These structures are fabricated by electron beam lithography (EBL) 1 2 , laser interference lithography (LIL) 3 4 , nanoimprint lithography (NIL) 5 6 7 8 9 , and anodic aluminum oxide (AAO) 10 11 . The LEE enhancements for the patterned green LEDs in the above reports range 19% to 25 times compared to the planar ones, depending on the nanostructure parameters and LEE measuring conditions.…”
mentioning
confidence: 99%
“…As to the AAO technique, self-organized wet etching of aluminium in spatially regular, triangular order seems to be the simplest and lowest cost one among all the above methods 12 . However, it is disposable and not easy to transfer the AAO pattern to the emission surface directly, especially in mass production 10 11 .…”
mentioning
confidence: 99%
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“…As shown in Figure 1(b), a classical dipole source embedded between the p-GaN layer and the n-GaN layer was used to represent the carrier recombination within the active layer. The emission wavelengths were set as 620 nm, 520 nm, and 465 nm which are most representative of red, green, and blue light emissions, respectively [22][23][24].…”
Section: Model Of Simulation and Numerical Methodsmentioning
confidence: 99%
“…A vast scientific effort has been made during the last decade to find the best and commercially reasonable solution. Many different surface treatment techniques like electron beam lithography, laser interface lithography, nanoimprint lithography or anodic aluminum oxide were successfully established [2][3][4][5][6][7][8][9]. Unfortunately, these methods are expensive, time-consuming or unsuitable for large-scale wafer manufacturing and their LEE varies from tens to hundreds of percent, depending on the layer parameters and LEE measuring conditions [10].…”
Section: Introductionmentioning
confidence: 99%