2012 IEEE International Integrated Reliability Workshop Final Report 2012
DOI: 10.1109/iirw.2012.6468927
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Optimized data assessment for hot carrier and Fowler-Nordheim stresses on thick MOS gate oxides with plasma process induced charging damage

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Cited by 5 publications
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“…Typically, hot electrons and electrostatic charges impact are distinguished by the fact that hot electrons (a case of direct current) are a process associated with a small current and a long time, and an electrostatic charge with a process associated with a large current and a short time. Accordingly, there are various methods When it comes to instability caused by the influence of a relatively small current left over from an electrostatic charge on the drain and the effect of hot electrons, the degradation of parameters can affect both output transistors and internal VLSI transistors [6,7].…”
Section: Introductionmentioning
confidence: 99%
“…Typically, hot electrons and electrostatic charges impact are distinguished by the fact that hot electrons (a case of direct current) are a process associated with a small current and a long time, and an electrostatic charge with a process associated with a large current and a short time. Accordingly, there are various methods When it comes to instability caused by the influence of a relatively small current left over from an electrostatic charge on the drain and the effect of hot electrons, the degradation of parameters can affect both output transistors and internal VLSI transistors [6,7].…”
Section: Introductionmentioning
confidence: 99%