1999
DOI: 10.1016/s0040-6090(98)01704-0
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Optimizing GaSb and GaSb(001) surfaces for epitaxial film growth

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Cited by 3 publications
(2 citation statements)
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“…Despite the availability of ''epi-ready'' GaSb substrates, further treating wafers chemically [11,12] to reduce oxide thickness and/or with ultraviolet radiation/ozone to facilitate carbon removal has proven beneficial [13][14][15]. Proper baking of the MBE system and outgassing of the gallium cell reduces Ga-oxides in the source material, another major source of surface defects [16].…”
Section: Introductionmentioning
confidence: 99%
“…Despite the availability of ''epi-ready'' GaSb substrates, further treating wafers chemically [11,12] to reduce oxide thickness and/or with ultraviolet radiation/ozone to facilitate carbon removal has proven beneficial [13][14][15]. Proper baking of the MBE system and outgassing of the gallium cell reduces Ga-oxides in the source material, another major source of surface defects [16].…”
Section: Introductionmentioning
confidence: 99%
“…Surface atoms are consumed during the desorption process, thus excessively thick oxide layers may cause roughening or leave the surface non-stoichiometric. Treating the substrate with a UV-ozone process prior to growth has been shown to substantially reduce carbon at the surface of the wafer, a major source of contamination in MBE grown material [66,67]. In this technique contaminants are removed from the wafer surface and oxide re-growth is encouraged by the UV-ozone exposure.…”
Section: Oxide Desorption Conditionsmentioning
confidence: 99%