Optimizing properties of ultra-low-density fiberboard via response surface methodology and evaluating the addition of a coupling agent

Abstract

The main production process parameters of ultra-low-density fiberboard (UDF) were selected by use of response surface methodology, and then the properties of UDF were improved by adding a coupling agent. Microstructures and chemical bonding in UDF were analyzed by scanning electron microscopy and infrared spectroscopy. The results showed that the desirable process parameters for UDF production were the amount of urea-formaldehyde resin adhesive (18%), the hot pressing temperature (170 °C), the hot pressing time (200 s), and the amount of KH560 coupling agent added (1%). The main physical and mechanical properties of UDF obtained included internal bond strength (0.59 MPa), modulus of rupture (19.8 MPa), and 24h thickness swelling (10.0%). These properties exceeded the requirements of ISO 16895 (2016).

Wood fibre recapture from process water during wet-forming of fiberboard: Process modelling with environmental and economic assessment

“…Nevertheless, the preservation and restoration of technological lines for fibreboard production using the "wet" method is reasonable both from an economic and environmental point of view. Requirements of standards regulating the environmental safety of boards and their physical and mechanical properties determining their further use in various industries are becoming more stringent (Gao et al 2011;Mancera et al 2011;Ihnat et al 2017Ihnat et al , 2018Ihnat et al , 2020Song et al 2018;Li et al 2019;Park et al 2020).…”