Optimizing the precision of the four-point bend test for the measurement of thin film adhesion

Shaviv, Roey; Roham, Sassan; Woytowitz, Peter

doi:10.1016/j.mee.2005.06.006

Cited by 57 publications

(28 citation statements)

References 10 publications

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“…Albeit a rare event, such findings are uncommon in regular 4-point bend delamination test (Ma, 1997 Reimanis et al, 1990Reimanis et al, , 1991Ritchie et al, 1993;Phillipps et al, 1993;Ma et al, 1995Ma et al, , 1997Klingbeil and Beuth, 1997;Dauskardt, et al, 1998;Lane, et al, 2000aLane, et al, , 2000bHasegawa, et al, 2003;Hughey, et al, 2004;Shaviv, et al, 2005), corresponding investigations and experimental results on subcritical crack growth properties are extremely limited (Oh et al, 1988;Cannon et al, 1991;Shaw et al, 1994;McNaney et al, 1996;Hasegawa and Kagawa, 2006;Hirakata, et al, 2006). In this chapter, the dependence of FCG on metal layer thickness in a multi-layer thin film stack is studied.…”

Section: Discussionmentioning

confidence: 95%

Numerical Simulation and Experiments of Fatigue Crack Growth in Multi-Layer Structures of MEMS and Microelectronic Devices

Siegmund¹

2006

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Public reporting burden for this collection of information is estimated to average 1 hour per response, including the time for reviewing instructions, searching data sources, gathering and maintaining the data needed, and completing and reviewing the collection of information. Send comments regarding this burden estimate or any other aspect of this collection of information, including suggestions for reducing this burden to Washington Headquarters Service, Directorate for Information Operations and Reports, 1215 Jefferson Davis Highway, Suite 1204, Arlington, VA 22202-4302, and Numerical studies predict that increased constraint and smaller size will accelerate fatigue failure due to changes in plastic deformation. Strain gradients significantly affect the process. Measurements of toughness and fatigue crack growth resistance for the model material system are reported. New test protocols for the commonly used 4 point bend delamination test are developed such that both cracks can be propagated and the number of test data obtained is doubled. The novel approach is also essential for fatigue crack growth. While crack growth resistance was rather independent of the thickness of and fatigue crack growth rates were found to be dependent of film thickness. The dependence of the failure behavior on film thickness arises primarily due to enhanced crack path deflection for decreasing film thickness. Material separation in fracture and fatigue is characterized through a cohesive zone law. The model captures the Paris-law type response obtained in experiments, and also predicts that for thinner films the tendency to crack. Damage tolerant design requires accurate data on residual strength and fatigue crack growth resistance. Both quantities, however, depend on constraint and size of the structure considered. While this has been accounted for in residual strength analysis in the past, the present work provides enabling technologies to solve this problem for fatigue. With the conventional approach to fatigue crack growth, the transferability of data from lab to field, or between specimens and structures is not ensured. Thus, coefficients in the Paris law need to be determined experimentally for each level of constraint or each size of interest. It is, however, not ensured that even a large set of experiments will be able to capture all possible load scenarios. The cohesive zone model approach is provided here as alternative. Once cohesive zone parameters are determined, the dependence of fatigue crack growth on constraint and size emerges as the natural outcome of the analysis without the need to further model modifications. 3

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Section: Discussionmentioning

confidence: 95%

Numerical Simulation and Experiments of Fatigue Crack Growth in Multi-Layer Structures of MEMS and Microelectronic Devices

Siegmund¹

2006

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“…9 h curves obtained from macroscale specimens is well-established [3,35]. Nonetheless, it is important to investigate the P-h relationship unique to the clamped-end microscale specimens in this study.…”

Section: Accepted M Manuscriptmentioning

confidence: 99%

“…Deflection of a substrate fracture into the SiN/GaAs interface also required an accumulation of elastic energy. Once fracture deflection occurred, the release of strain energy allowed for short term unstable delamination of the interface until a dynamic equilibrium between the addition of strain energy and the resistance to delamination was reached [35]. The instability associated with fracture deflection and initial delamination was also represented by a pop-in (III).…”

Section: Accepted M Manuscriptmentioning

confidence: 99%

Inducing stable interfacial delamination in a multilayer system by four-point bending of microbridges

Mead

Huang

2017

Surface and Coatings Technology

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The ability to produce stable delamination of thin film multilayer interfaces is a powerful tool for studying the interfacial adhesion within microsystems. In this study, a technique involving the four-point bending of microbridges was applied to initiate stable interfacial delamination within a multilayer system. Microscale pre-notched bridges with clamped-ends were machined into an Al/SiN/GaAs multilayer using focus ion beam milling. A square flat-end indenter was used to induce bending of the bridge by two contact locations. Bridge failure occurred via substrate fracture at the pre-notch, followed by crack deflection, and stable interfacial delamination of the SiN/GaAs interface. Substrate fracture and delamination were identified within the obtained load-displacement curves as a pop-in and region of linear load reduction respectively.

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“…If there are free edges in the coating, the stress concentration will arise near the edges and make the coating susceptible to delamination from the substrate. The free edges can be exposed by prefabricated notch in the coating [12][13][14] or surface cracking 8 that initiates from the surface of the coating and extends to the interface vertically under the action of tensile stress in the coating induced by bending (Fig. 1a-c).…”

Section: Cracking Configurationmentioning

confidence: 99%

“…While practical adhesion is the total energy needed to separate the interface, including the elastic energy needed to create new surfaces and the energy dissipated in the plastic deformation or other sources. [9][10][11] In the past, a number of techniques such as four-point bending (4PB), [12][13][14][15] scratch, 16 indentation, [17][18][19] and pull-off tests 20,21 were developed based on the practical adhesion definition and applied to different coating/ substrate systems. Those methods usually evaluate the adhesion strength of the coating with the critical force or energy release rate (also named as crack driving force) needed to induce the interfacial crack.…”

Section: Introductionmentioning

confidence: 99%

Interfacial adhesion measurement of a ceramic coating on metal substrate

Nie

Zhou

et al. 2009

J Coat Technol Res

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The interfacial adhesion measurement of a ceramic coating on a metal substrate is studied by three-point bending (3PB) technique. In the measurement, interfacial cracks are induced during the 3PB test, and the interfacial energy release rate is calculated from the released energy per unit crack surface area during crack extension under the fixed displacement conditions. A finite element analysis (FEA) model encompassing the plastic behavior of the metal substrate is developed to simulate the 3PB test and extract the energy data. The inputs to the FEA model include the crack length, the maximum and critical loads corresponding to crack initiation, and the mechanical properties of the coating and substrate. A MoB/CoCr ceramic coating/stainless steel substrate system is investigated by the technique for demonstrating the utility of the technique.

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Optimizing the precision of the four-point bend test for the measurement of thin film adhesion

Cited by 57 publications

References 10 publications

Numerical Simulation and Experiments of Fatigue Crack Growth in Multi-Layer Structures of MEMS and Microelectronic Devices

Numerical Simulation and Experiments of Fatigue Crack Growth in Multi-Layer Structures of MEMS and Microelectronic Devices

Inducing stable interfacial delamination in a multilayer system by four-point bending of microbridges

Interfacial adhesion measurement of a ceramic coating on metal substrate

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