Materials Science in Semiconductor Processing
 2015
DOI: 10.1016/j.mssp.2015.01.054
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Optimum conditions of molding VFBGA chips with very minimal gold wire damage using the Taguchi methods

Chuen‐Shii Chou
1
,
Chung-Yung Chen
2
,
Wei Lü
3
et al.
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