Low resistance and high transparency of TCEs are two essential prerequisites for a variety of applications, including the fabrication of smart windows. [8] Among various TCEs, highly transparent and conductive indium tin oxide (ITO) is most commonly employed; however, its highly brittle nature hinders its application in flexible electronics and the scarcity of indium results in high material cost. [9] The bending strain tolerance and mechanical flexibility of ITO/elastomeric substrates are inadequate because of the brittle nature of ITO, which renders flexible ITO substrates impractical for real-life stretchable, foldable, or bendable optoelectronics applications. [10] In addition, the relatively low thermal conductivity of ITO leads to longer response times for devices reliant on thermally activated transitions, such as thermochromic smart windows. Extensive research has therefore been devoted to ITO alternatives including carbon-based TCEs such as graphene, [11] carbon nanotubes, [12] or conducting polymers, [13] and metal-based TCEs such as metal nanowires [14] or metal meshes. [15] Among these ITO alternatives, metal meshes, which are composed of periodic micro-or nanostructured metal networks on a transparent substrate, have gained considerable attention as high performance TCEs offering several advantages, including excellent mechanical flexibility, high conductivity, tunable transmittance, and low fabrication cost. [16,17] The current fabrication methods for these metal mesh films often involve low throughput, smallscale fabrication techniques such as e-beam lithography, nanoimprint lithography, photolithography, and laser writing, which are generally time-consuming and require substantial capital investment. Therefore, the nanosphere lithography method which involves a scalable, high throughput fabrication process of metal mesh films was introduced. [18] Nanosphere lithography (NSL) enables rapid, low-cost fabrication of deep submicron metal nanomesh (NM) patterns via the self-assembled formation of a hexagonal close packed monolayer of spherical particles which serves as a patterning mask. It provides a scalable and high throughput lithography process which can be implemented for both rigid and flexible substrates. [19] Moreover, NSL enables precise control over the