Optoelectronic parallel processing with surface-emitting lasers and free-space interconnects

Melt‐processed polymer multilayer distributed feedback lasers: Progress and prospects

“…The melt‐processed multilayers described and studied here are readily scalable for mass production of multilayer interference mirrors and DFB lasers, even over very large surface areas . These materials can form two‐dimensional surface‐emitting array lasers for parallel processing systems . For co‐extruded multilayer DFB laser systems, there are exciting prospects for commercial applications due to their simplicity, low‐cost, ease of processing, and flexibility as they continue improving toward the goal of matching or exceeding the lasing performance, low thresholds, and narrow linewidths of corrugated grating based DFB systems and other microresonator lasers.…”

The Optical Memory–Electric Computer Interface as a Parallel Processing Architecture

“…9, which determines which data matched the search criterion. We have designed and are currently implementing a CMOS array of photodetectors which can output only the selected data, thus conditioning the data transfer rate between the optical memory and the electronic computer [8]. The intelligent feature of this array of photodetectors is a selective row decoder.…”

“…Without a selective row decoder, the total time would have been T = [M (dn=pe + 1)]f 01 : (8) Obviously Eq. (7) is simplified to (8) for = 1.…”

“…Smart pixels can be implemented as combinations of detectors, emitters, and electronic logic. We have fabricated our smart pixels using heterostructure phototransistors as detectors and vertical cavity surface emitting lasers as emitters [8,9].…”

Fundamental Issues in Optical Interconnections

“…PHYSICAL SYSTEM ARCHITECTURE AND TECHNOLOGY PLATFORM DEVELOPMENT Many different systems employing optical interconnections in one form or another have been or are being developed. Although these specific devel-opment efforts may not he considered fundamental, they are important because they represent novelties or breakthroughs in design, architecture, packaging, or systems engineering (32,33,34].…”