Optoelectronic simulation and optimization of unconstrained four terminal amorphous silicon/crystalline silicon tandem solar cell

Navaraj, William Taube; Yadav, Beerendra Kumar; Kumar, Anil

doi:10.1007/s10825-015-0767-0

Cited by 4 publications

(4 citation statements)

References 11 publications

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“…43 For application such as photodetectors or solar cells, where higher absorptance is required along with flexibility, the optical path length in thin Si can be improved by using special optical trapping techniques such as Lambertian trapping, 44,45 texturing, 46 antireflection coatings. 47 Solar cells made from thin Si with optimal surface passivation show higher open circuit voltage as in this case the photo-generated carriers can be collected effectively before they recombine. This property of varying optical transmittance with thickness could also be exploited to monitor and control Si etching process as the thickness could be seen as a function of transmitted light.…”

Section: Optical Propertiesmentioning

confidence: 99%

Ultra-thin chips for high-performance flexible electronics

et al. 2018

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Flexible electronics has significantly advanced over the last few years, as devices and circuits from nanoscale structures to printed thin films have started to appear. Simultaneously, the demand for high-performance electronics has also increased because flexible and compact integrated circuits are needed to obtain fully flexible electronic systems. It is challenging to obtain flexible and compact integrated circuits as the silicon based CMOS electronics, which is currently the industry standard for high-performance, is planar and the brittle nature of silicon makes bendability difficult. For this reason, the ultra-thin chips from silicon is gaining interest. This review provides an in-depth analysis of various approaches for obtaining ultra-thin chips from rigid silicon wafer. The comprehensive study presented here includes analysis of ultra-thin chips properties such as the electrical, thermal, optical and mechanical properties, stress modelling, and packaging techniques. The underpinning advances in areas such as sensing, computing, data storage, and energy have been discussed along with several emerging applications (e.g., wearable systems, m-Health, smart cities and Internet of Things etc.) they will enable. This paper is targeted to the readers working in the field of integrated circuits on thin and bendable silicon; but it can be of broad interest to everyone working in the field of flexible electronics.

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Section: Optical Propertiesmentioning

confidence: 99%

Ultra-thin chips for high-performance flexible electronics

et al. 2018

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“…texturing, antireflection coatings [40] . Figure . 4(e) shows normalized weighted transmittance in the visible region for various thicknesses.…”

Section: Optical Analysis and Uv-visible-nir Spectroscopymentioning

confidence: 99%

Wafer Scale Transfer of Ultrathin Silicon Chips on Flexible Substrates for High Performance Bendable Systems

Navaraj

Gupta

Lorenzelli

et al. 2018

Adv Elect Materials

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This paper presents an innovative approach for wafer scale transfer of ultra-thin silicon chips on flexible substrates. The methodology has been demonstrated with various devices (ultrathin chip resistive samples, MOS capacitors and n-channel MOSFETs) on wafers up to 4" diameter. This is supported by extensive electro-mechanical characterization and theoretical analysis, including finite element simulation, to evaluate the effect of bending and the critical breaking radius of curvature. The ultra-thin chips on polyimide did not break until the radius of curvature of 1.437 mm. In the case of MOS capacitors the measured capacitance increases with increase in bending load. The changes in the transfer and output characteristics of ultra-thin MOSFETs closely match with the theoretical model utilizing empirically determined parameters. Overall, the work demonstrates the efficacy of the new methodology presented here for wafer scale transfer of ultra-thin chips on flexible substrates. The presented research will be useful for obtaining high performance and compact circuits needed in many futuristic flexible electronics applications such as implantable electronics and flexible displays. Further, it will open new avenues for realizing multi-layered multi-material (foil-to-foil) integrated bendable electronics.

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“…Amorphous silicon (a-Si) is a theoretically promising top cell material owing to its suitable bandgap of~1.7 eV when it is stacked with c-Si to made a tandem solar cell [45]. However, only a few studies have focused on a-Si/c-Si tandem devices [31,46,47]. To date, the highest efficiencies of a-Si/c-Si tandem solar cells have been 16.8% for a fourterminal device and 15.04% for a two-terminal device in 1990 [31].…”

Section: A-si As Top Cellmentioning

confidence: 99%

Possible top cells for next-generation Si-based tandem solar cells

Chen

Tang

2020

Front. Optoelectron.

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Si-based solar cells, which have the advantages of high efficiency, low manufacturing costs, and outstanding stability, are dominant in the photovoltaic market. Currently, state-of-the-art Si-based solar cells are approaching the practical limit of efficiency. Constructing Si-based tandem solar cells is one available pathway to break the theoretical efficiency limit of single-junction silicon solar cells. Various top cells have been explored recently in the construction of Si-based tandem devices. Nevertheless, many challenges still stand in the way of extensive commercial application of Si-based tandem solar cells. Herein, we summarize the recent progress of representative Si-based tandem solar cells with different top cells, such as III-V solar cells, wide-bandgap perovskite solar cells, cadmium telluride (CdTe)-related solar cells, Cu(In,Ga)(Se,S) 2 (CIGS)-related solar cells, and amorphous silicon (a-Si) solar cells, and we analyze the main bottlenecks for their next steps of development. Subsequently, we suggest several potential candidate top cells for Si-based tandem devices, such as Sb 2 S 3 , Se, CdSe, and Cu 2 O. These materials have great potential for the development of high-performance and low-cost Si-based tandem solar cells in the future.

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Optoelectronic simulation and optimization of unconstrained four terminal amorphous silicon/crystalline silicon tandem solar cell

Cited by 4 publications

References 11 publications

Ultra-thin chips for high-performance flexible electronics

Ultra-thin chips for high-performance flexible electronics

Wafer Scale Transfer of Ultrathin Silicon Chips on Flexible Substrates for High Performance Bendable Systems

Possible top cells for next-generation Si-based tandem solar cells

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