Optoelectronic-VLSI: photonics integrated with VLSI circuits

Krishnamoorthy, Ashok V.; Goossen, K.W.

doi:10.1109/2944.736073

Cited by 116 publications

(41 citation statements)

References 47 publications

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“…For example, a 6 stage system with over 60,000 light beams was demonstrated using such free-space optics [106]. Some earlier work focused on optical interconnected optoelectronic logic device arrays [99]- [101], and later work has investigated CMOS chips with large arrays of optoelectronic devices hybrid attached to the chips [107], [108]. Much of this work used quantum well diode structures exploiting the strong quantum-confined Stark effect electroabsorption [109] to make the optoelectronic logic or modulator devices.…”

Section: B)mentioning

confidence: 99%

“…Much of this work used quantum well diode structures exploiting the strong quantum-confined Stark effect electroabsorption [109] to make the optoelectronic logic or modulator devices. Device arrays with several thousand elements were demonstrated [108]. Other work used vertical cavity surface emitting laser (VCSEL) arrays (e.g., [102], [103], [106]).…”

Section: B)mentioning

confidence: 99%

“…QCSE devices are used in waveguide structures too, but, with their stronger absorption coefficient changes, they can be used for "surface-normal" devices of micron vertical dimensions (see, e.g., Ref. [108]. QCSE modulators are widely used in telecommunications, especially in integrated laser-modulator structures (see, e.g., Ref.…”

Section: B) Optical Modulators and Off-chip Lasersmentioning

confidence: 99%

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Device Requirements for Optical Interconnects to Silicon Chips

2009

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Abstract-We examine the current performance and future demands of interconnects to and on silicon chips. We compare electrical and optical interconnects and project the requirements for optoelectronic and optical devices if optics is to solve the major problems of interconnects to future high performance silicon chips. Optics has potential benefits in interconnect density, energy and timing. The necessity of low interconnect energy imposes low limits especially on the energy of the optical output devices, with a ~ 10 fJ/bit device energy target emerging. Some optical modulators and radical laser approaches may meet this requirement. Low (e.g., a few fF or less) photodetector capacitance is important. Very compact wavelength splitters are essential for connecting the information to fibers. Dense waveguides are necessary on-chip or on boards for guided wave optical approaches, especially if very high clock rates or dense WDM are to be avoided. Free space optics potentially can handle the necessary bandwidths even without fast clocks or WDM. With such technology, however, optics may enable the continued scaling of interconnect capacity required by future chips.

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Section: B)mentioning

confidence: 99%

Section: B)mentioning

confidence: 99%

Section: B) Optical Modulators and Off-chip Lasersmentioning

confidence: 99%

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Device Requirements for Optical Interconnects to Silicon Chips

2009

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“…Optical interconnects offer several well-known advantages for HPC systems such as higher spatial and temporal bandwidths, lower cross talk independent of data rates, higher interconnect densities, better signal integrity at high frequencies, lower signal attenuation, and lower power requirements at higher bit rates [2,3,[10][11][12][13][14], all of which could potentially achieve the much desired high bit rates data communication at a much reduced power level at the boardto-board distances of 0.1-1 m.…”

Section: A Optical Interconnects For High-performance Computing Systemsmentioning

confidence: 99%

Reconfigurable and adaptive photonic networks for high-performance computing systems

Kodi

Louri

2009

Appl. Opt.

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As feature sizes decrease to the submicrometer regime and clock rates increase to the multigigahertz range, the limited bandwidth at higher bit rates and longer communication distances in electrical interconnects will create a major bandwidth imbalance in future high-performance computing (HPC) systems. We explore the application of an optoelectronic interconnect for the design of flexible, high-bandwidth, reconfigurable and adaptive interconnection architectures for chip-to-chip and board-to-board HPC systems. Reconfigurability is realized by interconnecting arrays of optical transmitters, and adaptivity is implemented by a dynamic bandwidth reallocation (DBR) technique that balances the load on each communication channel. We evaluate a DBR technique, the lockstep (LS) protocol, that monitors traffic intensities, reallocates bandwidth, and adapts to changes in communication patterns. We incorporate this DBR technique into a detailed discrete-event network simulator to evaluate the performance for uniform, nonuniform, and permutation communication patterns. Simulation results indicate that, without reconfiguration techniques being applied, optical based system architecture shows better performance than electrical interconnects for uniform and nonuniform patterns; with reconfiguration techniques being applied, the dynamically reconfigurable optoelectronic interconnect provides much better performance for all communication patterns. Based on the performance study, the reconfigured architecture shows 30%-50% increased throughput and 50%-75% reduced network latency compared with HPC electrical networks.

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“…This allows the separation of the growth and processing of the optoelectronic devices from that of the silicon circuits, and allows a great deal of flexibility in the types of optoelectronic devices used. There are several variants of such techniques, and these have been reviewed recently [45], [46], [137]. These techniques will require continued work, but they appear to offer a practical solution to integration for dense optical interconnects to chips.…”

Section: ) Integration Technologiesmentioning

confidence: 99%