We present a complete silicon (Si) nano fabrication process to provide controlled shape nanostructures over large-scale Si surface area by combining our novel solvent controlled silica nanosphere (SNS) method with reactive ion etching. Our novel spin shows that the introduction of N,N-dimethyl-formamide solvent for SNS spin-coating can greatly enhance the uniformity of spin coated 2-dimensional SNS layer and its coverag significantly less sensitivity to deposition area. quality and coverage of SNS provided excellent nano for diverse etching applications. With our SNS lithography, reactive ion etching (RIE) has been applied with fluorine (F) and chlorine (Cl) based gases to provide (1) controlled etching selectivity between SNS (SiO 2 ) and Si substrate and (2) desired etching orientation depending on target shape of structure we focus on the fabrication of Si nanopillar various top diameters but fixed height which show improved anti-reflection effect. In addition, optical modeling with rigorous coupled wave analysis shows that well-tapered nanocone structures can provide greatly reduced incident light angle dependence for surface reflection.Index Terms -Nano-fabriation, silicon, reactive ion etching, silica nanosphere, rigorous coupled wave analysis, surface reflection, incident angle.