Organic substrate high-voltage performance: plausible capacitive isolation technology in integrated circuit package bill of materials

Tuncer, Enis; Gupta, Mohan; Heussner, Daryl; O’Connor, Shawn; Tran, Thi Thu Huong

doi:10.1007/s00202-019-00840-7

Cited by 4 publications

(1 citation statement)

References 12 publications

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“…Want to start with the most easily detected fault, because it is easy to find the test vector of easily detected fault, and the test time is short [16]. And the test vector of easy to test faults may detect difficult to test faults, so there is no need to test difficult faults separately.…”

Section: Digital Integrated Circuit Data Recognition Algorithmmentioning

confidence: 99%

Research on digital integrated circuit testing technology under Internet of Things technology

Li¹,

Meng²

2023

Second International Conference on Green Communication, Network, and Internet of Things (CNIoT 2022)

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Aiming at the problem of poor test accuracy of digital integrated circuits at present, this paper puts forward the research on digital integrated circuit test technology under the Internet of things technology, realizes circuit information collection and analysis through analog digital integrated circuit faults, and constructs an abnormal data identification algorithm of digital integrated circuits combined with the Internet of things technology. Finally, it is confirmed by experiments, under the Internet of things technology, digital integrated circuit test technology has high practicability in the process of practical application, which can effectively solve the problem of insufficient test accuracy of digital integrated circuit and fully meet the research requirements.

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Section: Digital Integrated Circuit Data Recognition Algorithmmentioning

confidence: 99%