Orientation-controlled nanotwinned copper prepared by electrodeposition

Hasegawa, Masaya; Mieszala, Maxime; Zhang, Yucheng; Erni, Rolf; Michler, Johann; Philippe, Laëtitia

doi:10.1016/j.electacta.2015.08.022

Cited by 51 publications

(31 citation statements)

References 45 publications

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“…The addition of acid to the electrolyte leads to the formation of hydrogen, and it was reported that with increasing hydrogen content, the density of twins increases ( 34 ). This seems to be similar to the case of pulse Cu deposits, where twins and the presence of hydrogen were observed ( 35 ). In the case of electrodeposited Ni, the influence of hydrogen is expected since Ni is a catalyst for hydrogen evolution, which could be correlated to twin-related grains grown epitaxially on Cu substrate ( 36 ).…”

Section: Discussionsupporting

confidence: 85%

High density of genuine growth twins in electrodeposited aluminum

et al. 2019

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Section: Discussionsupporting

confidence: 85%

High density of genuine growth twins in electrodeposited aluminum

et al. 2019

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“…According to the FFT, TBs are formed in (111) plane. The texture of the printed wire is similar to the previous bulk electrodeposited films . In addition, the d -spacing of the lattice was characterized through analysis of FFT of an HRTEM image (Figure S3).…”

mentioning

confidence: 60%

“…In this technique, a very high current density (on the scale of A/cm 2 ) and subsequently high deposition rate and high density of nucleation sites are achieved during the short period of on-time. Although the exact mechanism of twin formation in PED is still a matter of debate, ,, it is generally believed that stress relaxation during the t off results in formation of twins. , TBs are formed during the off-time, when the growth is interrupted and the deposited ions are relaxed and renucleated. The current interruption results in desorption of impurities and inhibitors from the growing deposit, and replenishes the metal ions in the diffusion layer.…”

mentioning

confidence: 99%

Localized Pulsed Electrodeposition Process for Three-Dimensional Printing of Nanotwinned Metallic Nanostructures

Daryadel¹,

Behroozfar²,

Morsali³

et al. 2017

Nano Lett.

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Nanotwinned-metals (nt-metals) offer superior mechanical (high ductility and strength) and electrical (low electromigration) properties compared to their nanocrystalline (nc) counterparts. These properties are advantageous in particular for applications in nanoscale devices. However, fabrication of nt-metals has been limited to films (two-dimensional) or template-based (one-dimensional) geometries, using various chemical and physical processes. In this Letter, we demonstrate the ambient environment localized pulsed electrodeposition process for direct printing of three-dimensional (3D) freestanding nanotwinned-Copper (nt-Cu) nanostructures. 3D nt-Cu structures were additively manufactured using pulsed electrodeposition at the tip of an electrolyte-containing nozzle. Focused ion beam (FIB) and transmission electron microscopy (TEM) analysis revealed that the printed metal was fully dense, and was mostly devoid of impurities and microstructural defects. FIB and TEM images also revealed nanocrystalline-nanotwinned-microstructure (nc-nt-microstructure), and confirmed the formation of coherent twin boundaries in the 3D-printed Cu. Mechanical properties of the 3D-printed nc-nt-Cu were characterized by direct printing (FIB-less) of micropillars for in situ SEM microcompression experiments. The 3D-printed nc-nt-Cu exhibited a flow stress of over 960 MPa, among the highest ever reported, which is remarkable for a 3D-printed material. The microstructure and mechanical properties of the nc-nt-Cu were compared to those of nc-Cu printed using the same process under direct current (DC) voltage.

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“…A small on‐time ( t on ) on the order of µ s‐ms and a relatively large off‐time ( t off ) is used for PED (Figure A, left panel). Although the exact mechanism of twin formation in PED is still a matter of debate, it is generally believed that stress relaxation during the t off results in formation of twins . TBs are formed during the off‐time, when the grain growth is interrupted and the deposited ions are relaxed and renucleated.…”

mentioning

confidence: 99%

Microscale 3D Printing of Nanotwinned Copper

et al. 2017

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Nanotwinned (nt)-metals exhibit superior mechanical and electrical properties compared to their coarse-grained and nanograined counterparts. nt-metals in film and bulk forms are obtained using physical and chemical processes including pulsed electrodeposition (PED), plastic deformation, recrystallization, phase transformation, and sputter deposition. However, currently, there is no process for 3D printing (additive manufacturing) of nt-metals. Microscale 3D printing of nt-Cu is demonstrated with high density of coherent twin boundaries using a new room temperature process based on localized PED (L-PED). The 3D printed nt-Cu is fully dense, with low to none impurities, and low microstructural defects, and without obvious interface between printed layers, which overall result in good mechanical and electrical properties, without any postprocessing steps. The L-PED process enables direct 3D printing of layer-by-layer and complex 3D microscale nt-Cu structures, which may find applications for fabrication of metamaterials, sensors, plasmonics, and micro/nanoelectromechanical systems.

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Orientation-controlled nanotwinned copper prepared by electrodeposition

Cited by 51 publications

References 45 publications

High density of genuine growth twins in electrodeposited aluminum

High density of genuine growth twins in electrodeposited aluminum

Localized Pulsed Electrodeposition Process for Three-Dimensional Printing of Nanotwinned Metallic Nanostructures

Microscale 3D Printing of Nanotwinned Copper

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