2009 Design, Automation &Amp; Test in Europe Conference &Amp; Exhibition 2009
DOI: 10.1109/date.2009.5090700
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ORION 2.0: A fast and accurate NoC power and area model for early-stage design space exploration

Abstract: Double patterning lithography seems to be a prominent choice for 32nm and 22nm technologies. Double patterning lithography techniques require additional masks for a single interconnect layer. Consequently, mask shift-induced overlay errors introduce additional variability into interconnect coupling capacitances. An important open question is whether overlay-induced performance impacts are more significant than performance variations caused by variability in interconnects. We provide TCAD as well as chip-level … Show more

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Cited by 563 publications
(347 citation statements)
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“…Included with the software release are algorithms for generating a mesh and a min-cut partitioning method (hierarchical star) similar to that of [6]. We modified COSI to incorporate the Orion 2.0 router and wire models [23], and also made a number of other changes to COSI to improve its operation and result reporting.…”
Section: Synchronous Network Generationmentioning
confidence: 99%
“…Included with the software release are algorithms for generating a mesh and a min-cut partitioning method (hierarchical star) similar to that of [6]. We modified COSI to incorporate the Orion 2.0 router and wire models [23], and also made a number of other changes to COSI to improve its operation and result reporting.…”
Section: Synchronous Network Generationmentioning
confidence: 99%
“…We conducted several experiments using a modified version of GEM5 as an appropriate cycle-accurate simulator (http: //gem5.org), a modified version of McPAT [17] and Orion [13] detailed models for cores and routers power consumption estimates, and the widely used HotSpot thermal model [24] to generate chip temperature map. The reference architecture we target is an Alpha21364 network architecture [20], that is used in real Web-servers and Data-centre contexts; commercial examples exist for this kind of architecture, based on the Alpha21264 processor core.…”
Section: A Experimental Setup and Methodology Evaluationmentioning
confidence: 99%
“…To enable power and thermal analysis, HORNET combines a dynamic power model based on ORION 2.0 [18] with a leakage power model; an accurate thermal model uses HOTSPOT 5.0 [19]. At runtime, various system configuration parameters (buffer sizes, port counts, etc.)…”
Section: B Power and Thermal Modelingmentioning
confidence: 99%