“…One class of gate dielectrics, inorganic oxide gate dielectrics, tends to exhibit a high dielectric constant ( k ) and strength with good chemical/thermal resistance. , However, a high temperature (>300 °C) and/or vacuum processes are generally needed to manufacture these types of materials. , In addition, these types of gate dielectrics contain polar moieties, which disturb the OSC to grow in highly stretched or long-range π-extended domains and adversely affect the OFET performance. , In particular, these polar moieties, such as hydroxyl groups, carboxyl groups, and acrylate groups, are activated as trapping sites, substantially degrading the electrical performance and stability of the OFETs, owing to decreased field-effect mobility (μ FET ), a shift in the threshold voltage ( V th ), and poor subthreshold swing (SS) and hysteresis behavior of the OFETs. , In addition, inorganic oxide materials are extremely vulnerable to mechanical bending stress , and to ambient air conditions that enable polar molecules (e.g., oxygen and water molecules) to easily permeate the OSC/dielectric interfaces, generating charge-trapping sites . For these reasons, polymeric gate dielectric materials are considered to be competitive alternatives for OFET-based devices.…”