OSP coatings: the nitrogen solution

Abstract

AIR LIQUIDE : CRCD 78350 Jouy en Josas -France I. AbstractFor the past several years, tin-lead has been the most commonly used circuit board finish, mainly because of its high solderability. But as the current evolutions in Electronics are pushing toward more and more stringent demands in terms of quality, miniaturization, costs and environmental legislation compliance, the Assembly industry must find an alternative to those circuit board finishes.